Advanced Packaging Integration Engineer (3D/Hybrid Bonding)
$138k - $190kApplied Materials, Inc.
A leading technology company in Santa Clara is looking for an Advanced Packaging Integration Engineer to develop high-performance optical interconnects. The role involves optimizing packaging processes and collaborating with multidisciplinary teams. Candidates with a M.S. or Ph.D. in relevant STEM fields and expertise in advanced packaging technologies are encouraged to apply. The position offers a competitive salary range of $138,000 to $190,000, along with a full-time role and opportunities for personal and professional growth. #J-18808-Ljbffr Applied Materials, Inc.
$138k - $190k
Advanced Packaging Integration Engineer page is loaded## Advanced Packaging Integration Engineerlocations: Santa... ...innovative advanced packaging and 3D integration solutions.As an **... ...heterogeneous integration, die stacking, hybrid bonding) to achieve best‐in‐class...3DFull timeWork at officeRelocation$147k - $202.5k
...leader in materials engineering solutions used to... ...new chip and advanced display in the world... ...‑to‑wafer (D2W) hybrid bonding R&D for silicon photonics and co‑packaged optics... ...de‑risking, and integration exploration. The... ...alignment, etc.) 2.5D/3D integration Strong...3DFull timeWork at officeRelocation- Siemens AG is looking for a Software Engineer in Santa Clara, California. This role involves developing innovative EDA software products for advanced packaging designs, integrating industry-leading tools, and providing technical guidance. The ideal candidate should possess...3D
$181.1k - $318.4k
Apple Inc. is seeking an experienced IC Packaging Engineer in Santa Clara, California. This role involves driving packaging development and leading cross-functional teams in advanced semiconductor packaging solutions. Candidates must have a passion for innovation and at...3D$181.1k - $318.4k
...versatile and passionate IC Packaging Engineer to join our team! Description... ...functional teams and lead SoC Package integration and architecture efforts Drive the industry with advanced package solutions, new... ...technologies (FOWLP, 2.5D, 3D, coreless MCM). Well versed with...3DRelocationOverseas$150k - $210k
...highly technical MEMS Integration Engineer to bridge the gap... ...integration. (3) Wafer Bonding Implementation: Act... ..., eutectic, and hybrid bonding to achieve long... ...induced stress. (4) TSV & 3D Integration: Lead... ...Vias (TSVs) for advanced device packaging. (5) Manage Foundry...3DImmediate start$210k - $265k
Piper Companies is looking for an Advanced Packaging Engineer to join a cutting‑edge startup developing... ..., with a strong emphasis on module integration and organic substrate technologies on... ...MCM, organic substrate, CoWoS, 2.5D, 3D packaging, TSMC system‑on‑wafer, OSAT...3DFor subcontractor$210k - $260k
...innovations across silicon, packaging, software, and systems... ...and has a world-class engineering team with decades of... ...a highly experienced Advanced Package Engineer to... ...single chip Flip Chip IC integration for next-generation... ...CoWoS‑class interposers 3D packaging and stacking...3DContract work- ...light, we are creating advanced photonic technologies... ...Role Role: Principal Packaging Engineer Department: Packaging... ...Design Location: US (Hybrid / Onsite) Employment... ...generation heterogeneous integration and advanced packaging... ...cutting‑edge 2.5D and 3D packaging solutions...3DPermanent employmentFull time
$110k - $155k
...Job Title: Advanced Package Design Engineer Office Location: San Jose, CA Work Model: Onsite About... ...architectures and heterogeneous integration solutions. You’ll collaborate closely... ...networks (PDN) ~ Familiar with 2.5D/3D packaging technologies, substrate design...3DFull timeWork at officeLocal area$147k - $202.5k
A leading technology solutions provider in Santa Clara is seeking a Process Engineer to develop and optimize hybrid bonding processes for semiconductor manufacturing. The successful candidate will collaborate with top industry experts and utilize state-of-the-art equipment...- ...Marketing Programs Manager - 3D IC Design & Advanced Packaging Solutions Job Reference... ...by heterogeneous integration and 3D IC architectures.... ...chiplets, wafer‑on‑wafer, hybrid bonding), and innovative approaches... ..., Electrical Engineering, Computer Engineering, or...3DFull timeWork at officeWork from home
$174k - $239.5k
...global leader in materials engineering solutions used to... ...virtually every new chip and advanced display in the world.... ...expert in **Advanced Packaging**. This role sits at... ...** trends (e.g., 2.5D/3D-IC, FOWLP, fan-out/fan... ...advanced substrates, hybrid bonding).* **Hands-on...3DFull timeRelocation$180k - $250k
...Senior Software Integration Engineer Sunnyvale, California, United States... ...in other adjacent areas (CAD/3D printing, PCB design, etc)... ...component of the total compensation package, which may also include... ...action to employ and advance in employment individuals without...3DFull timeFor contractorsFor subcontractorCasual workWork at officeRemote workDay shift$161k - $221k
...a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design... ...to develop advanced photonics packaging solution. You will lead optomechanical... ...includes working with 3D solid models, drawings, and...3DWork at office$133.5k - $183.5k
...global leader in materials engineering solutions used to produce virtually... ...every new chip and advanced display in the world. We design... ...knowledge of advanced packaging inflections including: Logic (2.5D/3D integration, chiplets, hybrid bonding) DRAM (HBM, TSV-based integration...3DFull timeRelocation$160k - $210k
...candidate will design and implement packaging solutions for micro-optic... ...that can lead to high-impact advances in technology. How you will... ...have M.S. in Electrical Engineering, Applied Physics or related field... ...assembly processes such as 3D and 2.5D assemblies Excellent...3DFull time$124k - $171k
Process Integration Engineer page is loaded## Process Integration Engineerlocations... ...every new chip and advanced display in the world. We design... ...interconnect and co-packaged optics. This position is in... ...(e.g. through silicon via, hybrid bonding, wafer bonding and thinning...Full timeWork experience placementRelocation- ...Product Line Manager (PLM) for Advanced Packaging & Metrology will drive... ...solutions. This hybrid role blends technical depth... ...Bachelor’s, Master’s, or PhD in Engineering, Physics, Materials... ...equipment (including 2.5D/3D packaging, hybrid bonding, chiplet architectures, fan...3DImmediate start
- Icehouseventures is looking for a Customer Integration Engineer to join their team in Sunnyvale, California. In this full-time role, you will... ...development vehicles are essential. The position operates under a hybrid work policy, offering flexibility to work from home and in...Full timeWork at officeWork from home
$120k - $220k
...experienced Electrical System Integration Engineer to design automotive‑grade... ...specifications Create and manage CAD (3D models, assemblies, 2D... ...of the total compensation package, which may also include... ...affirmative action to employ and advance in employment individuals...3DFull timeFor contractorsFor subcontractorCasual workWork at officeRemote workDay shift- ...Advanced Packaging Technical Leader Cisco is seeking a seasoned Advanced Packaging Technical... ...close partnerships with design engineering, operations, and supply chain teams... ...technology (flip-chip, fanout, 2.5D/3D, hybrid integration). Oversee various aspects such as package...3DContract work
- ...is looking for a Senior Software Engineer to design and implement a Workday connector that integrates their SaaS platform with Workday... ...in Santa Clara, CA, offers a hybrid work environment, and includes a competitive compensation package along with various benefits and...
- Siemens AG is looking for a Marketing Programs Manager focused on 3D IC Design & Advanced Packaging Solutions. The role involves developing marketing strategies, managing campaigns, and collaborating with teams to enhance market visibility. Candidates should have a Bachelor...3D
$168.8k - $241.2k
...Team Cisco is seeking a seasoned Advanced Packaging Technical Leader to join the Packaging... ...close partnerships with design engineering, operations, and supply chain teams... ...technology (flip-chip, fanout, 2.5D/3D, hybrid integration). Oversee various aspects such as package...3DFull timeContract workTemporary workLocal areaFlexible hours$140k - $200k
...We are seeking a Systems Integration Engineer to join Autoroboto, an organization focused on productizing... ...capture and sense the world around us, advancing form factors, or improving interaction... ...practices. ~ Strong understanding of 3d kinematics. ~ Experience working in...3D- ...imaging products. Candidates should have a Bachelor’s degree and a minimum of 1 year in sales or business development. The position is hybrid, balancing in-office and remote work, making it ideal for motivated individuals seeking to contribute to the company's growth. #J-1...3DWork at officeRemote work
$181.1k - $318.4k
...Apple product. As a Memory Packaging Engineer, you will architect the memory... ...efficiency, and system integration through meticulous co-design... ..., flip‑chip, and wafer/die bonding. Strong knowledge of packaging... ...education related to advancing your career at Apple, reimbursement...Work experience placementRelocation$160k - $220k
A stealth-mode semiconductor startup is seeking an Advanced Packaging Engineer to design advanced semiconductor packages and validate signal integrity. The ideal candidate will have a strong background in electrical engineering, proficiency in SI/PI simulation tools, and...$160k - $220k
Overview Advanced Packaging Engineer - Design & Signal Integrity We are a stealth-mode startup building foundational technology to address performance, scalability, and resiliency challenges in large-scale AI data center clusters. We are backed by top-tier VC firms and...For subcontractorRemote work
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