Advanced Packaging Integration Engineer (3D/Hybrid Bonding)
$138k - $190kApplied Materials, Inc.
A leading technology company in Santa Clara is looking for an Advanced Packaging Integration Engineer to develop high-performance optical interconnects. The role involves optimizing packaging processes and collaborating with multidisciplinary teams. Candidates with a M.S. or Ph.D. in relevant STEM fields and expertise in advanced packaging technologies are encouraged to apply. The position offers a competitive salary range of $138,000 to $190,000, along with a full-time role and opportunities for personal and professional growth. #J-18808-Ljbffr Applied Materials, Inc.
$138k - $190k
Advanced Packaging Integration Engineer page is loaded## Advanced Packaging Integration Engineerlocations: Santa... ...innovative advanced packaging and 3D integration solutions.As an **... ...heterogeneous integration, die stacking, hybrid bonding) to achieve best‐in‐class...3DFull timeWork at officeRelocation- Siemens AG is looking for a Software Engineer in Santa Clara, California. This role involves developing innovative EDA software products for advanced packaging designs, integrating industry-leading tools, and providing technical guidance. The ideal candidate should possess...3D
$181.1k - $318.4k
Apple Inc. is seeking an experienced IC Packaging Engineer in Santa Clara, California. This role involves driving packaging development and leading cross-functional teams in advanced semiconductor packaging solutions. Candidates must have a passion for innovation and at...3D$181.1k - $318.4k
...versatile and passionate IC Packaging Engineer to join our team! Description... ...functional teams and lead SoC Package integration and architecture efforts Drive the industry with advanced package solutions, new... ...technologies (FOWLP, 2.5D, 3D, coreless MCM). Well versed with...3DRelocationOverseas$150k - $210k
...highly technical MEMS Integration Engineer to bridge the gap... ...integration. (3) Wafer Bonding Implementation: Act... ..., eutectic, and hybrid bonding to achieve long... ...induced stress. (4) TSV & 3D Integration: Lead... ...Vias (TSVs) for advanced device packaging. (5) Manage Foundry...3DImmediate start$200k - $350k
...About the role Own different aspects of Packaging including Design Layout, SI/PI and Thermo... ...~ Exceptional abilities across the full advanced packaging design and tradeoffs ~10+ years... ...for Multi-die packaging (including 2.5D/3D) ~ Demonstrated ability to work closely...3DPermanent employmentH1bVisa sponsorshipWork visa$2,000 per month
...and staffed by leading engineers, Etched is redefining the... ...As a Signal & Power Integrity Engineer you will be responsible... ...across silicon, package, and board. The ideal... ...signaling solutions in advanced packaging. You will work... ...optimization within 2D/2.5D/3D packages Close...3DWork at officeRelocation package$133.5k - $183.5k
...global leader in materials engineering solutions used to produce virtually... ...every new chip and advanced display in the world. The role... ...knowledge of advanced packaging inflections including logic (2.5D/3D integration, chiplets, hybrid bonding), DRAM (HBM, TSV-based integration...3DFull timeRelocation$133.5k - $183.5k
...global leader in materials engineering solutions used to produce... ...virtually every new chip and advanced display in the world. We... ...knowledge of advanced packaging inflections including: Logic (2.5D/3D integration, chiplets, hybrid bonding) DRAM (HBM, TSV-based integration...3DFull timeRelocation$147k - $202.5k
A leading technology solutions provider in Santa Clara is seeking a Process Engineer to develop and optimize hybrid bonding processes for semiconductor manufacturing. The successful candidate will collaborate with top industry experts and utilize state-of-the-art equipment...- ...Marketing Programs Manager - 3D IC Design & Advanced Packaging Solutions Job Reference... ...by heterogeneous integration and 3D IC architectures.... ...chiplets, wafer‑on‑wafer, hybrid bonding), and innovative approaches... ..., Electrical Engineering, Computer Engineering, or...3DFull timeWork at officeWork from home
$174k - $239.5k
...global leader in materials engineering solutions used to... ...virtually every new chip and advanced display in the world.... ...expert in Advanced Packaging . This role sits at... ...trends (e.g., 2.5D/3D-IC, FOWLP, fan-out/fan... ...advanced substrates, hybrid bonding). Hands-on background...3DFull timeRelocation$133.5k - $183.5k
: Program Manager - Advanced Packaging (E4)Skip to main contentThis site uses cookies... ...is a global leader in materials engineering solutions used to produce virtually... ...** including: - Logic (2.5D/3D integration, chiplets, hybrid bonding) - DRAM (HBM, TSV-based integration...3DFull timeRelocation$124k - $195.5k
Join us in an outstanding opportunity as a Senior Package Modeling Engineer in the Advanced Technology Group (ATG) at NVIDIA. Using our history of innovation... ...packaging architecture and materials (flip‑chip, 2.5D/3D IC, CoWoS‑R, CoWoS‑L, advanced substrates). Excellent...3D$180k - $250k
...application development and integrations work (embedded... ...Computer Science, Computer Engineering or a related area... ...other adjacent areas (CAD/3D printing, PCB design,... ...total compensation package, which may also include... ...action to employ and advance in employment individuals...3DFull timeFor contractorsFor subcontractorCasual workWork at officeRemote workDay shift- Icehouseventures is looking for a Customer Integration Engineer to join their team in Sunnyvale, California. In this full-time role, you will... ...development vehicles are essential. The position operates under a hybrid work policy, offering flexibility to work from home and in...Full timeWork at officeWork from home
$152.5k - $244k
...seeking an experienced engineer to join our team researching advanced defect modeling,... ...semiconductor processes and 3D packaging technologies. This... ...TSVs, interconnects, hybrid bonding, and chip stacking. Perform... ...considerations in 3D integration. • Industry Exposure...3DVisa sponsorship- ...is looking for a Senior Software Engineer to design and implement a Workday connector that integrates their SaaS platform with Workday... ...in Santa Clara, CA, offers a hybrid work environment, and includes a competitive compensation package along with various benefits and...
$163k - $237k
Google is seeking a Chip Package Signal Integrity/Power Integrity Engineer to join the ML, Systems, & Cloud AI organization. You will contribute to developing custom silicon solutions that power the future of Google's products. Your responsibilities include managing chip...3D- Siemens AG is looking for a Marketing Programs Manager focused on 3D IC Design & Advanced Packaging Solutions. The role involves developing marketing strategies, managing campaigns, and collaborating with teams to enhance market visibility. Candidates should have a Bachelor...3D
$210.9k - $369.1k
...wafers and reticles, integrated circuits, packaging, printed circuit... ...devices that are advancing humanity all begin... ...teams of physicists, engineers, data scientists... ...solutions. This hybrid role blends technical... ...(e.g., 2.5D/3D integration, hybrid bonding, backside power delivery...3DMinimum wageWork experience placementFlexible hours$210.9k - $369.1k
...wafers and reticles, integrated circuits, packaging, printed circuit... ...devices that are advancing humanity all begin... ...teams of physicists, engineers, data scientists... ...solutions. This hybrid role blends technical... ...(e.g., 2.5D/3D integration, hybrid bonding, backside power delivery...3DMinimum wageWork experience placementFlexible hours$168.8k - $241.2k
...Team Cisco is seeking a seasoned Advanced Packaging Technical Leader to join the Packaging... ...close partnerships with design engineering, operations, and supply chain teams... ...technology (flip-chip, fanout, 2.5D/3D, hybrid integration). Oversee various aspects such as package...3DFull timeContract workTemporary workLocal areaFlexible hours$144k - $209k
Google Inc. in Sunnyvale is seeking a Packaging Design Engineer to lead the development of innovative packaging solutions for high-value hardware.... ...and at least 8 years of relevant experience. Strong skills in 3D CAD software and Finite Element Analysis are essential. A...3D- NVIDIA Gruppe is seeking an experienced professional to lead package-level reliability for semiconductor products in Santa Clara, California. The ideal candidate will possess a Master’s or PhD in a related field, along with 8+ years of hands-on experience in IC packaging...3D
- ...Director Of Mechanical Engineering, Hardware Platform... ...programmable in the way 3D printing is digital—but... ...work closely with our Hybrid Fab, giving you a fast... ...precision automation, and advanced manufacturing systems.... ...selecting and integrating sensors and actuators,...3D
$181.1k - $318.4k
...Apple product. As a Memory Packaging Engineer, you will architect the memory... ...efficiency, and system integration through meticulous co-design... ..., flip‑chip, and wafer/die bonding. Strong knowledge of packaging... ...education related to advancing your career at Apple, reimbursement...Work experience placementRelocation- ...career with us! Mechanical Engineer ( AI & Data Center... ...applications. This role focuses on advanced mechanical and thermal packaging solutions for high-... ...ramp Develop detailed 3D CAD models and... ...supply-chain teams to deliver integrated, system-aware solutions...3DContract workFlexible hours
$140k - $200k
We are seeking a Systems Integration Engineer to join Autoroboto, an organization focused on productizing... ...capture and sense the world around us, advancing form factors, or improving interaction... ...and practices. Strong understanding of 3d kinematics. Experience working in...3D- A global automotive leader is seeking a Power Electronics Engineer to join their team in Sunnyvale, CA. The ideal candidate will have a... ...simulations, and working with suppliers on component selection. This hybrid role allows for flexibility, requiring in-person attendance...
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