Senior 3D-IC Packaging & Integration Engineer
Siemens AG
Siemens AG is looking for a Software Engineer in Santa Clara, California. This role involves developing innovative EDA software products for advanced packaging designs, integrating industry-leading tools, and providing technical guidance. The ideal candidate should possess a Master's degree in electrical engineering with at least 5 years of relevant experience. Strong skills in Python and advanced packaging design principles are crucial. Siemens AG offers a collaborative work environment with opportunities to lead technology integration and enhance design workflows. #J-18808-Ljbffr Siemens AG
$181.1k - $318.4k
...Apple Inc. is seeking an experienced IC Packaging Engineer in Santa Clara, California. This role involves driving packaging development and leading cross-functional teams in advanced semiconductor packaging solutions. Candidates must have a passion for innovation and at...Senior3D$181.1k - $318.4k
...looking for versatile and passionate IC Packaging Engineer to join our team! Description You will... ...functional teams and lead SoC Package integration and architecture efforts Drive the industry... ...packaging technologies (FOWLP, 2.5D, 3D, coreless MCM). Well versed with DOE...3DRelocationOverseas- NVIDIA Gruppe is seeking an experienced professional to lead package-level reliability for semiconductor products in Santa Clara, California... ...a related field, along with 8+ years of hands-on experience in IC packaging and board level reliability, including familiarity...Senior3D
- ...Position Overview We are seeking a highly capable Customer Package Design Integration Engineer (2.5D / 3D Packaging) to ensure the successful execution of customer chiplet-based product development using Rapidus advanced packaging technologies. This role serves...Senior3DFull time
$124k - $195.5k
Join us in an outstanding opportunity as a Senior Package Modeling Engineer in the Advanced Technology Group (ATG) at NVIDIA. Using our history of... ...semiconductor packaging architecture and materials (flip‑chip, 2.5D/3D IC, CoWoS‑R, CoWoS‑L, advanced substrates). Excellent...Senior3D- ...NVIDIA Gruppe is looking for a skilled PCB Layout Engineer to engage in the design and development of advanced IC substrates. The ideal candidate will have 5+ years of relevant experience and a strong background in high-speed design using Cadence APD tools. This position...Senior
$138k - $190k
...A leading technology company in Santa Clara is looking for an Advanced Packaging Integration Engineer to develop high-performance optical interconnects. The role involves optimizing packaging processes and collaborating with multidisciplinary teams. Candidates with a...3DFull time$138k - $190k
...Advanced Packaging Integration Engineer page is loaded## Advanced Packaging Integration Engineerlocations: Santa Clara,CAtime type: Full timeposted... ...‐packaged optics through innovative advanced packaging and 3D integration solutions.As an **Advanced Packaging Integration...3DFull timeWork at officeRelocation$210k - $300k
...Companies is seeking a Principal Advanced IC Packaging Engineer who will develop and refine Chip-on-... ...teams to ensure flawless chip-package integration. Lead failure analysis and drive yield... ...with EMIB, InFO, and advanced 2.5D/3D integration technologies is a plus. Strong...3D- ...interconnects to scalable photonic engines, Lumilens is unlocking a new... ...are seeking an experienced IC Package Mechanical FEA Engineer to... ...emerging packaging and photonic‑integration technologies, including co‑... ...flip‑chip, FOWLP, 2.5D/3D integration, chiplet architectures...3DLocal area
$180k - $250k
...application development and integrations work (embedded applications,... ...in Computer Science, Computer Engineering or a related area Deep understanding... ...in other adjacent areas (CAD/3D printing, PCB design, etc)... ...of the total compensation package, which may also include equity...Senior3DFull time- ...Overview We are seeking a highly motivated Chiplet Package Design Engineer to drive the development of advanced packaging solutions... ...semiconductor products. This role focuses on 2.5D and 3D heterogeneous integration , enabling high-performance computing, AI, networking...Senior3DFull time
$160k - $210k
...candidate will design and implement packaging solutions for micro-optic... ...have M.S. in Electrical Engineering, Applied Physics or related field... ...assembly processes such as 3D and 2.5D assemblies... ...presentations), can work with senior external partners with ease....Senior3DFull time- ...breakthrough technology takes more than great engineering—it takes a team of exceptional people... ...Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical... ...chiplet-based designs, and heterogeneous integration, leading efforts from early technology...Senior
$156k - $229k
...Mechanical, Material, Electrical Engineering, Technology, Science, a... ...years of experience in chip package substrate design using Cadence... ...(PoP), InFO, RDL, IPD, 2.5D/3D, Chiplet. Preferred qualifications... ...performance, efficiency, and integration. Google’s mission is to...Senior3DFull timeWorldwide$135k - $190k
...Senior/Staff Packaging Development Engineer page is loaded## Senior/Staff Packaging Development Engineerremote type... ...are worldwide technical leaders in Integrated Power Semiconductors and Systems... ...level applications.* ANSYS Icepak/Q3D/Mechanical Preferred.* System level...Senior3DFor subcontractorWorldwide$136k - $212.75k
Responsibilities Collaborate with Technical Package Lead and different design... ..., detailed layout of IC substrates for NVIDIA... ...Requirements Hold a B.S. Electrical Engineering or equivalent experience. 5+... ...of high-speed design signal integrity practices. Experience with Virtuoso...Senior- ...Senior Technical Lead- TIA Design Full Time Opportunity... ...total compensation package (higher compensation packages... ...beyond. Measure IC performance and debug... ...Package-system integration Solid expertise with... ...custom analog layout and 3D EM modeling Team player...Senior3DFull timeFlexible hours
- ...Overview: This role is for a highly skilled and experienced Packaging Design Engineer to own bump-bond, die-attach, adhesive, and fiber-... ...closely with other packaging engineers, as well as integrated circuit (IC) design, mechanical, and reliability teams to create robust...SeniorContract work
- ...A technology startup in San Jose is seeking an experienced IC Package Mechanical FEA Engineer to develop high-performance packaging solutions for advanced ASICs. The ideal candidate will possess a Bachelor's in Mechanical Engineering or related field and have extensive...
- ...What You’ll Be Doing Own the package‑level reliability spec for assigned... ...to See MS/PhD in Electrical Engineering, Materials Science,... ...experience Strong background in IC packaging and board level reliability... ...with BGA/FCBGA, 2.5D/3D integration, HBM or similar high power, high...Senior3D
- ...We Are Synopsys is the leader in engineering solutions from silicon to systems,... ...verification teams to ensure StarRC integrates seamlessly into customer signoff... ...extraction challenges in CPU designs, 3D IC systems, and advanced packaging structures The Impact You Will...Senior3DDay shift
$172k - $237.8k
42dot Inc. in Sunnyvale, California, is seeking a Senior or Staff Software Engineer to lead the development of next-generation digital cockpit technologies... ...primarily focuses on delivering high-fidelity, real-time 3D environments for in-vehicle infotainment and advanced...Senior3D$100k - $160k
...Monolithic Power Systems Inc. is seeking a Senior Application Engineer in San Jose, California. The role involves defining and debugging analog IC products for automotive computing... ...supplies. We offer a comprehensive benefits package, including health coverage, stock...Senior- ...Job Description Coherent's Integrated Circuit team designs &... ...delivered more than one billion ICs over the past 25 years solving... ...self-driven Lead IC Applications Engineer to lead the creation of customer... ...with SI/PI and 2.5D/3D EM board simulation tools is highly...3D
$136k - $218.5k
We are looking for a Senior Signal Integrity Engineer. We work closely with NVIDIA sites... ...own product line of PHY IC’s. Taking the products from... ...400Gb/s per lane for PCBs, packages, connectors and cables Design... ...passive and active elements in 3D and 2D simulation tools...Senior3D$210k - $260k
...innovations across silicon, packaging, software, and systems to deliver... ...mode and has a world-class engineering team with decades of... ...advanced single chip Flip Chip IC integration for next-generation high-performance... ...CoWoS‑class interposers 3D packaging and stacking...3DContract work$141.3k - $226k
...A leading semiconductor company in San Jose is looking for an IC Substrate and Package Layout Engineer. The ideal candidate will design and layout advanced substrates and IC packages, collaborating with cross-functional teams to ensure high-performance results. This role...Senior$180k - $250k
...A tech company specializing in automotive software is seeking a Software Integration Engineer to develop embedded applications for intelligent vehicles. You will work directly with customers, delivering software solutions and collaborating across teams to achieve seamless...Senior$163k - $237k
Google is seeking a Chip Package Signal Integrity/Power Integrity Engineer to join the ML, Systems, & Cloud AI organization. You will contribute to developing custom silicon solutions that power the future of Google's products. Your responsibilities include managing chip...3D
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