Memory Packaging Engineer
$181.1k - $318.4kApple Inc.
Santa Clara, California, United States Hardware Join the team at the heart of memory innovation for every Apple product. As a Memory Packaging Engineer, you will architect the memory solutions that power the industry-leading performance of Apple's hardware. We push the boundaries of bandwidth density, power efficiency, and system integration through meticulous co-design between memory technology and our world‑class systems. If you are driven to solve the industry's toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions. Description In this role, you will drive the definition, development, and qualification of next‑generation memory packages critical to Apple’s future products. You will guide the package roadmaps of our memory partners and collaborate with internal engineering teams to enable bandwidth and density scaling. Your ownership will span the entire product lifecycle, from initial concept through qualification. Responsibilities Determine the direction of next‑generation package architecture by evaluating available and emerging packaging technologies. Collaborate with cross‑functional teams to solve integration challenges, including electrical, mechanical, and thermal. Drive vendor DOEs and failure analysis to improve downstream yield and maintain world‑class quality and reliability. Define the memory package POR (plan of record): Package form factor, process, layout, stackup, and bill of materials (BOM). Drive memory vendors to develop package materials and technology for leading‑edge package design rules. Minimum Qualifications BS and 10+ years of relevant industry experience Preferred Qualifications MS or PhD preferred, with 10+ years of industry experience in package design and assembly process development of high‑bandwidth and high‑density memory packages. Strong knowledge of thin‑die stacking technologies including wirebond, flip‑chip, and wafer/die bonding. Strong knowledge of packaging materials and design to engineer warpage and CTE properties and mitigate thermal challenges. Solid working experience in package test and reliability, system‑level downstream process interaction, and packaging inspection metrology. Deep understanding of SI/PI co‑design with memory die and high‑speed DDR or differential signaling. Understanding of how memory die floorplan and architecture influence package structure and routing, with experience collaborating with memory die design teams. Excellent communication skills for collaborating with internal teams and managing external vendors. At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $181,100 and $318,400, and your base pay will depend on your skills, qualifications, experience, and location. Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program. Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong. Learn about accessibility in Apple’s workplace Learn about reasonable accommodations for job applicants Apple accepts applications to this posting on an ongoing basis. #J-18808-Ljbffr Apple Inc.
$181.1k - $318.4k
Apple Inc. is seeking a seasoned Memory Packaging Engineer in Santa Clara, California. This pivotal role involves defining and developing next-generation memory packages for Apple's hardware, collaborating with cross-functional teams, and driving vendor partnerships. The...Suggested- ...enabling direct optical connections among thousands of GPUs and memory units. The company's SuperSwitch is an ultra-low power... ...Overview: This role is for a highly skilled and experienced Packaging Design Engineer to own bump-bond, die-attach, adhesive, and fiber-attach...SuggestedContract work
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A global leader in materials engineering solutions is seeking an Optical Fiber Packaging Engineer to lead the development of optical fiber packages from ideation to production. This role requires expertise in mechanical design, optical alignment, and reliability testing...- Siemens AG is looking for a Software Engineer in Santa Clara, California. This role involves developing innovative EDA software products for advanced packaging designs, integrating industry-leading tools, and providing technical guidance. The ideal candidate should possess...
$181.1k - $318.4k
...and dedication to your job and there's no telling what you could accomplish! We are looking for versatile and passionate IC Packaging Engineer to join our team! Description You will be responsible for IC packaging development Work with cross-functional teams and lead...RelocationOverseas$138k - $190k
Advanced Packaging Integration Engineer page is loaded## Advanced Packaging Integration Engineerlocations: Santa Clara,CAtime type: Full timeposted on: Posted Todayjob requisition id: R2615409**Who We Are**Applied Materials is a global leader in materials engineering solutions...Full timeWork at officeRelocation- A leading semiconductor design firm is seeking a seasoned hardware engineering professional for advanced silicon package design. You will collaborate with teams to define performance requirements and lead the design of innovative silicon package solutions. The ideal candidate...Remote job
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Optical Fiber Packaging Engineer page is loaded## Optical Fiber Packaging Engineerlocations: Santa Clara,CAtime type: Full timeposted on: Posted Todayjob requisition id: R2615285**Who We Are**Applied Materials is a global leader in materials engineering solutions used...Full timeRelocation$138k - $190k
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...Johnson, we respect the diversity and dignity of our employees and recognize their merit. Job Function Supply Chain Engineering Job Sub Function Packaging Design Engineering Job Category Scientific/Technology Location Santa Clara, California, United States of America...Work experience placementLocal areaImmediate start- ...enabling direct optical connections among thousands of GPUs and memory units. The company's OCS is an ultra-low power consumption,... ...Qualifications PhD in Materials Science, Applied Physics, Electrical Engineering, or related field 7 - 15+ years of experience in...
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$160k - $210k
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