Senior Power Integrity Engineer - LPU Packaging

What you’ll be doing Define best‑in‑class power delivery design and optimization practices from die/package through board, tray, and rack levels for the full product development cycle Own the PI specification and methodology for assigned products, defining PDN targets including impedance, droop, noise, and transient response for GPU, HBM, and high‑speed SerDes Architect package‑level PDNs by collaborating with design teams on bump/ball maps, via structures, and decoupling strategies for FCBGA and 25D/3D integrations Drive system‑level PI design, including board‑level PDN planning, decap placement, and VRM interfaces while co‑optimizing with SI, thermal, and mechanical teams Perform PI extraction and simulation for advanced packages and develop integrated chip–package–board co‑simulation flows using industry‑standard tools Generate and deploy reusable PI models, such as SPICE, S‑parameter, and IBIS‑AMI, for use by internal and external partners Define and execute comprehensive lab validation plans to correlate measured impedance, noise, and droop against simulation data and specifications Debug complex system‑level issues including rail noise, jitter‑induced errors, resets, and margin loss during hardware testing and validation What we need to see MS or PhD in Electrical Engineering or a related field, or equivalent experience 12+ years of relevant work experience in Power Integrity A strong background in power integrity for high‑current, low‑voltage rails within large GPUs, ASICs, or CPUs Proven ownership of the chip‑package‑board PDN design and sign‑off process Hands‑on experience with FCBGA, 25D/3D integration, HBM, or similar high‑power, high‑pin‑count packages Direct experience in the co‑design of bump/ball maps, power/ground planes, and decoupling capacitor networks Proficiency with frequency‑domain PDN impedance analysis and time‑domain transient/droop simulation tools (e.g., PowerSI, PowerDC, Sigrity, RedHawk, Totem, HFSS, SIwave, ADS, or SPICE) A deep understanding of board‑level PDN design, including stack‑up definition, plane partitioning, and VRM placement on high‑layer‑count accelerator boards Experience in executing lab measurements using VNAs, oscilloscopes, and PDN analyzers to correlate measured noise and droop to original specifications Ways to stand out from the crowd Demonstrated leadership of end‑to‑end PI for a major GPU, CPU, or ASIC program from initial concept through mass production Experience with data center or cloud hardware, specifically regarding rack‑level power distribution and how PI choices impact performance headroom Background in co‑designing SI and PI for high‑speed interfaces like PCIe, NVLink, CXL, or Ethernet SerDes to mitigate jitter and noise coupling Strong communication skills with the ability to clearly explain complex PDN trade‑offs and risks to both technical teams and program stakeholders Compensation and Benefits Base salary ranges are USD196,000–310,500 for Level5 and USD232,000–368,000 for Level6, with additional equity and benefits. The offer will be determined by location, experience, and comparable positions. Equal Opportunity Employment NVIDIA is committed to fostering a diverse work environment and is an equal‑opportunity employer. We do not discriminate on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status, or any other characteristic protected by law. #J-18808-Ljbffr NVIDIA Gruppe