Lead Advanced Packaging Engineer - 2.5D/3D ML Chips
$156k - $229kGoogle is seeking an Advanced Packaging Technologist in Sunnyvale, California. You will work on IP-driven TPU (Tensor Processing Unit) technology that powers Google's AI/ML applications. This position demands expertise in custom silicon development, specifically in packaging technology, and offers opportunities to innovate in the semiconductor packaging space. The role includes responsibilities for developing packaging solutions for advanced technology, collaborating across teams, and influencing high-volume manufacturing processes. The US base salary range for this full-time position is $156,000-$229,000, plus bonus, equity, and benefits. #J-18808-Ljbffr Google
Vacancy posted 3 days ago
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