Process Engineering Supervisor

Reporting directly to the Process Engineering Manager, the supervisor will lead, mentor, and direct a team of process engineers dedicated to optimizing manufacturing workflows, improving product yields, maintaining quality standards, and implementing advanced PCB manufacturing technologies. Duties/Responsibilities: Supervise, mentor, and evaluate the day-to-day performance of a team of process engineers. Assign engineering projects, establish goals, monitor milestones, and ensure technical accountability across all assignments. Promote a culture of continuous learning, technical growth, teamwork, and continuous improvement. Assist the Process Engineering Manager with resource planning, performance reviews, and hiring process. Will be required to perform other duties as requested, directed, or assigned. Oversee and troubleshoot PCB fabrication processes across wet processing (plating, etching, surface finish), dry processing (drill, route, lamination), imaging, and solder mask. Drive root-cause analysis and corrective/preventive actions (CAPA) for yield losses, customer returns, or scrap spikes. Establish, standardize, and maintain standard operating procedures (SOPs) and short sheets (SS). Support new product introduction (NPI) to ensure seamless transition from design/prototyping to full-scale volume production. Lead Six Sigma and Lean Manufacturing initiatives to enhance throughput, reduce waste, and increase overall equipment effectiveness. Apply Statistical Process Control (SPC) tools to monitor capability (Cp & Cpk), identify trends, and maintain tight process windows. Work collaboratively with Quality Assurance, Operations, and Maintenance teams to maintain compliance with industry standards (IPC, ISO, AS9100, NADCAP). Requirements: Bachelor's degree in Chemical Engineering, Mechanical Engineering, or a related field. 3+ years of process engineering experience in printed circuit board (PCB) or semiconductor fabrication. 1-3 years of team lead, supervisory, or project management experience within a manufacturing environment. Excellent problem solving, communication and leadership skills. Proficient computer skills and knowledge. Highly motivated, enthusiastic, and committed to driving excellence. Deep understanding of printed circuit board manufacturing, IPC standards, and Quality Management Systems (QMS). Certification in Six Sigma, Lean Manufacturing, or related methods. Experience with advanced PCB technologies (e.g., HDI, RF, Flex, Rigid Flex, Book Binders). Proficiency in statistics and statistical software such as Minitab. Familiarity with CAD/CAM tools. Excellent verbal and written communication skills with the ability to bridge complex details with shop-floor execution. Amphenol offers a competitive salary and benefits. The candidate must be able to legally work in the United States; we are unable to provide sponsorship. Position requires candidate to be a U.S. person as defined in ITAR, 22 CFR 120.15 (U.S. Citizenship or Resident Alien Status) and defined by 8 U.S.C. 1101(a) (20). Amphenol is a proud Equal Opportunity Employer as to all protected groups, including Individuals with Disabilities and Protected Veterans. Amphenol is a proud Equal Opportunity Employer as to all protected groups, including Individuals with Disabilities and Protected Veterans. #J-18808-Ljbffr Amphenol Apc