Principal Application Engineer Semiconductor Advanced Package

Steele and Associates

Job Description

Senior Technical Applications Engineer – Semiconductor Packaging

We are seeking an experienced Senior Technical Applications Engineer to support advanced semiconductor packaging technologies and materials. This role will serve as the technical lead working directly with customers to optimize packaging processes, troubleshoot material-related challenges, and drive successful product adoption.

The ideal candidate will bring extensive experience in semiconductor advanced packaging, wafer-level encapsulation, and molding technologies, along with the ability to collaborate across technical and commercial teams to deliver innovative customer solutions.

Responsibilities

Serve as the primary technical expert supporting advanced semiconductor packaging materials.
Partner with customers to optimize wafer-level and panel-level encapsulation and molding processes.
Troubleshoot complex material and process issues in both development and production environments.
Support new product introductions and ensure successful adoption of advanced packaging materials.
Conduct material characterization and application development activities.
Work closely with engineering, research and development, product management, and commercial teams to translate customer requirements into technical solutions.
Lead technical discussions, presentations, and customer engagements.
Stay current on industry trends and emerging semiconductor packaging technologies.

Qualifications

Bachelor's degree in Materials Science, Chemical Engineering, Mechanical Engineering, or a related technical field.
10+ years of experience in semiconductor advanced packaging materials or processes.
Strong expertise in wafer-level encapsulation and molding technologies.
Experience with epoxy molding compounds (EMC).
Knowledge of advanced packaging architectures including 2.5D and 3D packaging.
Excellent problem-solving, project management, and communication skills.
Ability to work independently while managing multiple customer projects.
Customer-focused mindset with strong technical leadership capabilities.

Preferred Experience

Semiconductor packaging process development.
Advanced material characterization.
Customer-facing applications engineering or technical support.
New product commercialization and qualification activities.

Additional Information

Full-time position
Relocation assistance may be available
Comprehensive benefits package
Occasional travel required (approximately 10%)

If you have a strong background in semiconductor packaging technologies and enjoy working directly with customers to solve complex technical challenges, we encourage you to apply.

Apply

Vacancy posted 2 days ago

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