Principal Optoelectronic Packaging Engineer

Descripción

Puesto en Samtec, Inc

Founded in 1976, Samtec is a privately held, $1 billion global manufacturer of broad line electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service. 

 

Samtec is seeking an Advanced packaging and process architect to join our team at the Vista Design Center located in Vista, CA. 

 

The advanced packaging and process architect is a senior engineering leader responsible for designing, developing, and implementing next-generation optoelectronic packaging solutions. In this key role as a subject matter expert in the development of 2.5D/3D packaging solutions, you'll be instrumental in harnessing leading-edge technologies to create Samtec’s next generation optical module products. 

 

Essential Functions/ Responsibilities: 

• Research & Innovation: Research and analyze emerging material and process technologies within a roadmap connecting capabilities and products.
• Architecture Development: Guide the physical architecture of advanced optoelectronic packages based on a broad knowledge of interconnect technologies (RDL, wire bonding, flip chip, solder, conductive adhesives, etc.) materials (semiconductors, glass, laminates, ceramics, polymers, adhesives, etc.), and automated assembly techniques (SMT, wire bonding, die attach, curing, thermal bonding, spot curing, solder reflow, epoxy dispense, etc.)
• Process Development: Lead the development and integration of assembly processes in R&D, prototyping, and volume production environments. Apply Six Sigma methodologies (DMADV) and FMEA to design and document new processes. Ensure optical module reliability by conducting necessary testing to meet commercial and military standards.
• Process Transfer: Interface with internal and external operations teams, collaborating closely with production teams on equipment and process improvements. Transfer scalable processes to  manufacturing operations, both domestic and international.
• Mentorship: Mentor process development engineers on DOE (Design of Experiments) techniques, failure analysis, and operation of automated and mechanized equipment to support package builds for low, medium, and high-volume production.
• Collaboration: Work closely with marketing, process engineering, and R&D teams to align goals and realize outcomes.

 

The responsibilities, as defined, are intended to serve as a general guideline for this position. Associates may be asked to perform additional tasks depending on strengths and capabilities. 

  

Required Experience: 

• Experience: 
• 15-25 years of experience building optoelectronic packages in a manufacturing environment.
• 10+ years conducting research on new materials and processes.
• 10+ years developing processes on automated and semi-automated equipment.
• Direct experience working in a manufacturing environment, including familiarity with cleanroom protocols and equipment.
• Technical Expertise: 
• Extensive knowledge of materials, interconnect technologies, equipment, and process development for optoelectronic module assembly.
• Deep understanding of automated and mechanized equipment used semiconductor packaging and assembly.
• Familiarity with 3D printing using polymers for various applications.
• Solid understanding of optical module reliability and testing protocols.
• Soft Skills: 
• Strong communication skills: Excellent written, verbal, and presentation abilities.
• Independent problem-solver with the ability to work within a multi-disciplinary engineering environment.
• Highly organized with the capacity to manage multiple priorities effectively.
• Proficient in Microsoft products with the ability to adapt to new software.

Education: 

• BS or MS in Electrical, Materials, Chemical, or Mechanical Engineering or an equivalent degree.

 

Salary and benefit offerings:

The preferred locationfor this position is the Samtec Vista Design Centerin San Diego/Vista, CA. At this site, the salary range is $187,000 – $212,000 annually, based on experience, plus generous Samtec bonusespaid three times per year (February, August, and late fall).

A secondary optionis the Silicon Valley Design Centerin Santa Clara, CA, where the salary range is $220,000 – $250,000 annually, based on experience, plus the same bonus structure.

The third locationis the Samtec Microelectronics facilityin Colorado Springs, CO, with a salary range of $159,000 – $180,000 annually, based on experience, plus bonuses as noted above.

Relocation assistanceis available only for moves to the preferred location (San Diego/Vista, CA).

Samtec's generous benefits package includes medical (HSA/PPO) dental, vision, hearing, group life, AD&D, short- and long-term disability, EAP, 401K match / profit sharing (Samtec will contribute 7% of your total gross pay to your 401(k) plan regardless of any contributions you make and will match the first 5% of your contribution to the 401(k)-plan dollar for dollar), plus other voluntary options, as well as paid time off.

 

Apply now if you have what it takes and are interested in joining Samtec’s vaunted culture, with competitive salaries and world-class benefits.