Packaging Engineer, Sr.

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary We are seeking a highly motivated Staff Packaging Engineer with the capability to lead advanced integrated circuit (IC) packaging development and manage the introduction of new product technologies. The ideal candidate will drive innovation in packaging for Data Center, AI, Power Management, Compute, and emerging markets, ensuring the transfer of these technologies into high-volume manufacturing with assembly suppliers. Extensive expertise in Flip Chip, Wire Bond, and System in Package (SiP) assembly processes, as well as familiarity with related materials and equipment, is required. The role demands strong leadership in multi‑functional teams and the ability to solve complex technical problems, especially when collaborating with multiple Outsourced Semiconductor Assembly and Test (OSAT) providers. Experience with Wafer-on-Wafer bonding is considered a plus. Duties and Responsibilities Explore, develop, and deploy FCCSP, FCBGA, and/or SiP/Module packaging technologies for high-volume manufacturing. Initiate and define package process flows, material sets and Best Known Methods (BKM), test vehicles, Design of Experiments (DOEs) and cornering, and process control plans to ensure the successful development of manufacturable and reliable products. Interface with OSATs, substrate and material suppliers, and tool makers to develop technology in alignment with product requirements. Coordinate with internal product teams on establishing Design Rules. Collaborate with the internal design team and promote Design for Manufacturability (DFM) methodology for new technologies. Work with internal design, modeling, and procurement teams to implement packaging solutions that are technically optimal and cost‑effective. Manage technical programs, including planning, execution, and monitoring of complex processes or product developments. Provide regular updates on program status to management and share progress with cross‑functional team members. Demonstrate strong knowledge and understanding of Failure Mode and Effects Analysis (FMEA), Statistical Process Control/Quality Control (SPC/QC) concepts, failure mechanisms, failure analysis techniques, manufacturing floor operations, and quality issue resolution. Ideal Candidate At least 8+ years of experience in the development and high-volume manufacturing of advanced IC packages. Expertise in Flip Chip CSP, FCBGA, and SiP packaging materials, assembly processes, equipment, and design rules. Strong understanding of Laser Groove technology and Wire Bond process optimization. Excellent verbal and written communication skills. Demonstrated ability in organized technical project management. Capable of working independently and leading multiple programs. Able to lead multi‑functional teams to address complex technical challenges. Self‑driven, passionate, and creative. Minimum Qualifications Bachelor’s degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience. Or Master’s degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience. Or PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field. Preferred Qualifications Hands‑on experience in package manufacturing, technical project management, and direct collaboration with semiconductor material suppliers. Understand industry packaging trends, end‑user packaging needs, and prior experience with high‑end mobile consumer products. Proficiency in material and package characterization and statistical data analysis. Familiarity with reliability test methods and qualification procedures.Six Sigma Green or Black Belt certification is a plus. Educational Requirements Required: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or related field, or equivalent practical experience. Preferred: Master’s degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or related engineering field. Compensation and Benefits Pay range: $127,200.00 – $190,800.00. This scale reflects the broad, minimum to maximum, pay scale for this role at the posted location. Salary is one component of total compensation; additional benefits include a competitive annual discretionary bonus program and the opportunity for annual RSU grants (employees on sales‑incentive plans are not eligible for our annual bonus). A highly competitive benefits package supports success at work, at home, and at play. Equal Opportunity Employer Qualcomm is an equal opportunity employer. We are committed to making our workplace accessible for individuals with disabilities and to providing reasonable accommodations during the hiring process. Protection of Confidential Information Qualcomm expects employees to abide by all applicable policies and procedures, including security and other requirements regarding protection of company confidential information and other proprietary information, within permissible law. #J-18808-Ljbffr Qualcomm