Staff IC Packaging Engineer

Overview We are seeking a highly motivated Staff IC Packaging Engineer to lead the development and commercialization of advanced integrated circuit (IC) packaging technologies. This role focuses on driving innovation and enabling new product introductions. The ideal candidate will possess deep expertise in advanced packaging architectures and assembly processes, and will lead technology development from concept through high-volume manufacturing (HVM) in collaboration with outsourced semiconductor assembly and test (OSAT) partners. Responsibilities Lead development and deployment of advanced packaging technologies including FCCSP, FCBGA, SiP/Modules, RDL-based packages, and 2.5D/3D integration. Drive new product introduction (NPI) from concept to successful transfer into high-volume manufacturing. Define and optimize package architectures, including high-density interconnects, die-to-die (D2D) integration, and performance/reliability trade‑offs. Develop and establish process flows, material sets, best known methods (BKM), and process control plans. Design and execute design of experiments (DOE), test vehicles, and process characterization for technology development and qualification. Collaborate with OSATs, foundries, substrate vendors, and material suppliers to align technology development with product requirements. Partner with internal design, modeling, and product teams to implement design for manufacturability (DFM) and establish design rules. Lead cross‑functional programs, managing timelines, risks, and deliverables across multiple concurrent projects. Apply strong knowledge of FMEA, SPC/QC, reliability testing, and failure analysis to ensure robust product development. Troubleshoot and resolve complex technical and manufacturing issues across development and production stages. Minimum Qualifications Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of system/package design/technology engineering or related work experience. OR Master’s degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of system/package design/technology engineering or related work experience. OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of system/package design/technology engineering or related work experience. Preferred Qualifications Advanced degree (M.S. or Ph.D.) in a relevant engineering discipline. Strong expertise in flip chip (CSP/FCBGA) and wire bond technologies. Strong expertise in system in package (SiP) and module integration. Strong expertise in redistribution layer (RDL), wafer bonding, and advanced packaging (2.5D/3D). Experience with high‑density interconnect design, substrate technologies, and package architecture. Hands‑on knowledge of assembly processes, materials, and equipment. Familiarity with wafer‑level processes, wafer‑on‑wafer bonding, and dicing technologies. Understanding of reliability standards, qualification methods, and failure mechanisms. Experience working with OSATs, foundries, and contract manufacturers. Strong background in statistical data analysis and process optimization. Knowledge of laser groove technology and wire bond process optimization is a plus. Six Sigma Green or Black Belt certification is a plus. Experience in IC packaging development and high‑volume manufacturing. Compensation and Benefits $154,000.00 – $231,000.00 In addition to your salary, we offer a competitive annual discretionary bonus program and opportunity for annual RSU grants. A highly competitive benefits package is designed to support your success at work, at home, and at play. EEO Statement Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, veteran status, or any other protected classification. #J-18808-Ljbffr Qualcomm