Packaging Media & Collateral Engineer for Reliability
Intel Corporation
Intel Corporation in Phoenix, AZ, is seeking a Packaging Module Development Engineer to advance assembly media and collaterals, focusing on reliability, manufacturability, and cost efficiency. You will design solutions, apply DOE and SPC, evaluate media under heat, humidity, and cycling, and lead risk mitigation while collaborating with the Media Development group to meet technology milestones. This on-site role emphasizes hands-on design, testing, and documentation of improvements to support #J-18808-Ljbffr Intel Corporation
Vacancy posted 4 days ago
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