Manufacturing Engineer, Advanced

is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~16,800 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more 

Our culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

This role will be responsible for supporting thick film products throughout the manufacturing and test processes, as well as supporting Multi-chip Modules (MCMs) and ASIC components designed and tested within the Colorado Springs Technology Center. In addition, the engineer will partner with R&D organizations to introduce new thick film components and ASIC products and verify their manufacturability. The job duties of the Product Engineer include:

• Troubleshooting DC/RF test failures within the cleanroom manufacturing environment
• Performing failure analysis for field failures and internal failures
• Developing clear, data-driven reports that communicate failure mechanisms and recommend design or process improvements
• Collaborate closely with R&D teams to transition new thick-film, MCM, and ASIC products into manufacturing
• Serve as the technical point of contact for manufacturing, quality, and business stakeholders
• Statistically analyze production test data to identify yield trends, drift, and systemic issues, including limit setting and adjustment
• Typical thick film/MCM/ASIC product engineer handles 50-100 products with volumes ranging from 20/year to 18k/year
• Continuous Process Improvement including Six Sigma and LEAN are a focus of our operations
• Excellent communication and teamwork skills are critical to success in this role

• BSEE Degree or MSEE Degree
• Over 7 years of manufacturing engineering experience with high-speed electrical components
• Knowledge/Experience with CPI (Continuous Process Improvement) and Lean methodologies
• Experience with ASIC failure analysis methods
• Strong understanding of RF fundamentals (S-parameters, insertion loss, impedance matching, etc.)

Pay Range:

USD $100,850.00 - USD $168,080.00 Year

***Keysight is an Equal Opportunity Employer.***