Senior IC Packaging Architect (FCBGA/SiP)
Ethernovia, Inc.
Ethernovia, Inc. seeks a visionary Principal IC Package Design Engineer to lead architecture and execution of advanced packaging for next-gen Ethernet switches and PHYs.
You will own the package lifecycle from feasibility to mass production, collaborating with Silicon Design, Systems/PCB, and OSAT vendors. The role demands deep expertise in Flip-Chip BGA, SiP, and multi-chip modules, plus strong leadership and communication skills to drive cross-functional programs in a fast-growing hardware
#J-18808-LjbffrVacancy posted 2 days ago
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