Product Designer

Package Design EngineerCelestial AI's Photonic Fabric™ is the next-generation interconnect technology that delivers a tenfold increase in performance and energy efficiency compared to competing solutions. The Photonic Fabric™ is available to our customers in multiple technology offerings, including optical interface chiplets, optical interposers, and Optical Multi-chip Interconnect Bridges (OMIB). This allows customers to easily incorporate high bandwidth, low power, and low latency optical interfaces into their AI accelerators and GPUs. The technology is fully compatible with both protocol and physical layers, including standard 2.5D packaging processes. This seamless integration enables XPUs to utilize optical interconnects for both compute-to-compute and compute-to-memory fabrics, achieving bandwidths in the tens of terabits per second with nanosecond latencies.About The RoleWe are seeking an experienced Package Designer with expertise in heterogeneous integration. The ideal candidate will have a strong background in semiconductor packaging design to drive Celestial AI's Photonic Fabric Package solutions. This role requires cross-functional design collaboration with multiple engineering groups, such as Packaging, ASIC, AMS, Photonics, and external partners to ensure design for manufacturing, assembly, reliability, and cost.Essential Duties And ResponsibilitiesPackage Design:Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC designers to develop a portfolio of packages that meets a huge range of performance design points, while optimizing re-use in other Celestial AI products.Scope all aspects of package design feasibility at Silicon interposer and substrate level for multi-chip SiP packaging.Support pre/post silicon bring up, yield improvement activities, qualification, failure analysis, and system implementation.Package Layout Expertise:Lead all aspects of package layout based on I/O, SI-PI and form factor requirements, including routing, design for reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing.Meet specifications for high-speed interfaces such as HBM, DDR, PCIe and 56G/112G SerDes.2.5D and 3D Package Design Planning and Execution:Plan and execute Silicon interposer and RDL based design layout solutions for advanced packaging architectures.Netlist management for heterogeneous chiplet assemblies using latest EDA solutions.Substrate Manufacturing and OSAT Assembly Engagement:Support activities related to production and assembly of IC packages with substrate suppliers and OSATs.Work with cross-functional teams and support package integration and architecture efforts with vendors.Actively participate in qualification of package and board level assembly with sensitivity to physics of failures for high thermo-mechanical reliability, driving appropriate test vehicle definition and design.Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Celestial AIQualificationsEducation: BS/MS/PhD in EE/ECE/MSE/ME/ChemE or related disciplines.Experience: 5-10 years of experience in Semiconductor Packaging Design of heterogeneous architectures, including silicon interposer and RDL designs.Technical Expertise:Extensive experience working with advanced packaging design tools such as Cadence APD.Experience working with MCAD tools such as SolidWorks, AutoCAD and interconversion of package design databases to MCAD files.Knowledge and insights to deliver high density/high performance interconnects in various 2.5D/3D packaging technologies including InFO, CoWoS, FoCoS and EMIB.Understanding of cross-functional packaging areas: Si floor plan, package, board layout and architecture, design rules, BOM, enabling material/process technologies, thermal, mechanical, Signal/Power Integrity, design for manufacturing, assembly, reliability, and cost.Familiarity with photonics packaging is a plus but not necessary.Substrate Vendor and OSAT Engagement:Proven track record of working with substrate vendors to meet design for manufacturing, yield, and reliability.Proven track record of engagement with OSATs to meet assembly requirements and drive new developments to meet new product requirements.Industry Knowledge: Experience in High Speed Signaling best practices, Signal and Power integrity requirements.Soft Skills: Strong analytical, problem-solving, cross-functional collaboration, project management, and technical presentation skills.Preferred QualificationsExpertise in heterogeneous integration, fan-out packaging, chiplet architectures – co-design, layout, and netlist management.Knowledge of Signal and Power Integrity.Experience in substrate vendor and OSAT assembly engagement to meet manufacturing and assembly requirements.Location: Santa Clara, CAFor California Location: As an early stage start up, we offer an extremely attractive total compensation package inclusive of competitive base salary, bonus and a generous grant of our valuable early-stage equity. The target base salary for this role is approximately $185,000.00 - $225,000.00. The base salary offered may be slightly higher or lower than the target base salary, based on the final scope as determined by the depth of the experience and skills demonstrated by candidate in the interviews.We offer great benefits (health, vision, dental and life insurance), collaborative and continuous learning work environment, where you will get a chance to work with smart and dedicated people engaged in developing the next generation architecture for high performance computing.Celestial AI Inc. is proud to be an equal opportunity workplace and is an affirmative action employer.