Senior Photonics Engineer

Senior Photonics Engineer

General Dynamics Mission Systems designs, prototypes, packages, and tests custom photonic integrated circuit (PIC) and photonic subsystem solutions for mission-critical defense and intelligence applications.

We are seeking a Senior Photonics Engineer to lead photonic design execution across multiple programs and technology platforms. You will tackle a wide breadth of photonic and optoelectronic design challenges from integrated photonic circuits to optical communication systems to more complex and advanced systems.

Core Responsibilities:

• Lead the full PIC design cycle process: requirements analysis, component and circuit design, simulation, layout, foundry tape-out, post-fabrication test, and design iteration
• Design PIC circuits and components using foundry PDKs and first-principles approaches as needed
• Execute PIC layout using Luceda IPKISS or equivalent tools
• Perform photonic simulation using Lumerical, Tidy3D, Photonforge, or equivalent tools
• Manage tape-out with domestic foundries including design rule checks, foundry interface, and run coordination
• Lead testing and characterization activities for fabricated PIC devices optical and electrical measurements on bare die and packaged parts
• Design PICs with packaging in mind fiber coupling, electrical fanout (wirebond and flip-chip), thermal, and mechanical constraints
• Contribute to optical system and link-level design and trade studies where programs extend beyond the chip level
• Mentor junior engineers and team members
• Contribute to IRAD projects and technology development
• Participate in customer-facing technical discussions and design reviews
• Contribute to technical and cost proposals

We encourage you to apply if you have these skills and experiences:

• Bachelor’s degree in Electrical Engineering, Photonics, Applied Physics or other relevant field plus a minimum of 8 years of relevant experience OR Master’s degree plus a minimum of 6 years of relevant experience OR PhD degree plus a minimum of 3 years of relevant experience
• Experience with full-lifecycle PIC design: concept modeling tape-out test
• PIC layout tools (Luceda IPKISS, Photonforge, or equivalent)
• Photonic simulation tools (Lumerical, Tidy3D, or equivalent)
• Foundry tape-out experience at a commercial photonics foundry.
• Experience on at least one major photonics platform: silicon, silicon nitride, lithium niobate
• Working knowledge of core PIC building blocks: waveguides, couplers, ring resonators, AWGs, MZIs, modulators, photodetectors
• PIC test and characterization fiber-coupled and probe-based measurements
• Technical leadership or mentorship of small engineering teams
• Python or scripting for design automation or test

Nice to have:

• Post-fabrication packaging experience: fiber array attach, wirebond or flip-chip integration, optical alignment, or managing external packaging vendors
• Multi-platform PIC experience across two or more of: silicon photonics, silicon nitride, III-V (InP), thin-film lithium niobate (TFLN)
• Optical system-level design or systems engineering for communication or sensing systems
• Familiarity with active photonic devices (lasers and amplifiers) and their integration into PIC-based systems
• RF photonics or analog photonic link design
• Nonlinear photonics (microresonator frequency combs, four-wave mixing, stimulated Brillouin scattering)

What sets you apart:

• A track record of taking a PIC from concept through tape-out to packaged, tested hardware the complete journey, not just simulation or layout
• Multi-platform adaptability across different material systems and foundry processes
• Experience specifying packaging requirements and managing external assembly vendors to deliver integrated photonic modules
• Technical leadership on small design teams defining approach, distributing work, and delivering as a team
• Combined depth in PIC design and breadth in optical or RF system-level engineering you design the chip and understand the system it lives in
• Adjacent domain experience in free-space optical (FSO) communication systems, fiber-optic telecom systems, or RF systems.
• Ability to think creatively, multi-task, and communicate with internal and external stakeholders
• Identifies opportunities to apply AI for continuous improvement and innovation