Lead 3D Heterogeneous Integration Engineer
GLOBALFOUNDRIES
GlobalFoundries is seeking an experienced R&D engineer to join the Advanced Packaging Lab (APL) and lead 3D-Heterogeneous Integration initiatives, including wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer development. You will work with fab and vendor teams to drive end-to-end integration, enable rapid prototyping, and push advanced packaging capabilities across multiple programs. Strong DOE and communication skills are essential. #J-18808-Ljbffr
Vacancy posted 3 days ago
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