Yield Development Engineer

Overview As a Yield Development Engineer, you will play a pivotal role in driving the advancement of semiconductor technology and ensuring the manufacturability of Intel's leading-edge products. Your contributions will directly impact the development and optimization of high-yielding processes, enabling Intel to maintain its leadership in innovation and technology. By collaborating across process, design, module, and test teams, you will identify root cause yield limiters and implement solutions that enhance overall product quality and efficiency. Key Responsibilities Analyze defect and process data to identify root causes through board level assembly process, and accelerate process improvements. Perform statistical analyses of defect imaging data to identify key failure modes of the board level assembly process. Lead failure analysis to determine root causes of defects using advanced FA techniques. Collaborate with cross-functional teams to debug yield issues and identify key failure modes of board level assembly process. Develop automatic imaging process for defect detection and analysis. Conduct and design lab experiments in collaboration with factory task forces to advance yield improvement. Develop tools, algorithms, and methodologies to perform high-volume data analysis for root cause findings. Qualifications Minimum Qualifications Bachelor's degree in Applied Physics, Materials Science, Electrical Engineering, Chemical Engineering, Chemistry, Physics, Microelectronics, or a similar technical field. 0-2+ years of experience with a Bachelor's degree. Preferred Qualifications Experience working in a lab-based environment with destructive and non-destructive analysis techniques such as dye and pry, X-section, SEM, X-ray. Familiarity with tools such as Mentor Graphics, and statistical analysis software like JMP. Strong problem-solving skills and the ability to work in a fast-paced, collaborative environment. Excellent verbal and written communication skills to present findings and collaborate effectively with cross-functional teams. Knowledge of advanced failure analysis techniques, such as high resolution SEM, EDS, and Ion Milling. Proficiency in automated imaging methodologies, defect root cause analysis, and defect detection techniques. Hands-on experience with optical microscopy imaging, SEM imaging, and cross-section polishing techniques. Demonstrated ability to analyze big data sets and drive data-informed decisions for process and yield improvements. Additional Information Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Work Model This role will require an on-site presence. Company and Benefits Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers. We ensure our foundry customers\' products receive our utmost focus in terms of service, technology enablement and capacity commitments. We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and benefits such as health, retirement, and vacation. The annual salary range shown reflects the minimum and maximum target compensation for the position across all US locations: $85,200.00–$120,280.00 USD. Specific compensation is determined by location, skills, experience, and education. Legal and Compliance Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge fees during the hiring process. If you are asked to pay any fees, report this to your recruiter. #J-18808-Ljbffr