Packaging Module Development Engineer

Job Details: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. Job Description: The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by: Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel’s future packaging platforms. Collaborating with multifunctional and cross-organizational teams to develop assembly equipment and optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. Innovating next generation equipment, materials, and fabrication processes to enhance semiconductor packaging capabilities at scale. Managing equipment development, including pathfinding, new equipment definition, equipment selection, technology development, and high-volume manufacturing. Managing projects to meet product development timelines. Applying formal education and judgment to solve technical problems. Providing sustaining support for equipment performance and process health in high-volume manufacturing. Responding promptly to foundry customer requests and events. The ideal candidate will demonstrate: Technical leadership, strategic planning, and critical thinking. Ability to coach and develop technical teams. Tolerance for ambiguity and adaptability in a dynamic environment. Flexibility in managing changing priorities and responsibilities. Experience leading teams in a highly matrixed organization. Initiative and ability to work independently. Strong communication, influencing, technical, and analytical skills. This position requires regular onsite presence. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences. Minimum Qualifications PhD degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field; OR Master’s degree in mechanical engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field. Candidates who are within four (4) months of completing the required degree are eligible to apply. Minimum 1+ years of experience in the following: Mechanical design, equipment development, or manufacturing systems, preferably within semiconductor or advanced manufacturing environments. Strong experimental background, including hands-on laboratory or prototype development experience. At least one first-author publication in a peer-reviewed technical journal for PhD candidates. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD #J-18808-Ljbffr