Staff Design Engineer, HBM Architecture
Micron Technology, Inc
Staff Design Engineer, HBM Architecture We are seeking a highly motivated HBM Datapath Architect to architect, design, and optimize high‑speed data paths for next‑generation High Bandwidth Memory (HBM) products. This role focuses on logic‑die and core‑die datapath circuitry, enabling industry‑leading bandwidth, power efficiency, reliability, and scalability across JEDEC and custom HBM solutions. Responsibilities Architect and design HBM read and write datapath across core and logic die, including alignment, buffering, timing, and control logic Develop high‑speed, low‑latency datapath circuits supporting multi‑channel HBM architectures and wide internal buses Optimize datapath designs for bandwidth, power, area, and timing closure at advanced technology nodes Design and integrate data reliability features, including parity, ECC hooks, lane redundancy, and remapping mechanisms Collaborate with multi‑functional teams to translate specifications into robust micro‑architectures Collaborate with PHY, DFT, verification, and layout teams to ensure accurate functionality, testability, and manufacturability Drive schematic‑level and RTL‑level datapath implementations, including clocking, gating, and reset strategies Contribute to design reviews, documentation, and technical mentoring across HBM programs Required Qualifications Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field with 6+ years of relevant industry experience, or a Master’s degree with 4+ years of relevant industry experience 2+ years of experience in high‑speed digital datapath design (memory, SerDes, or SoC datapath) 2+ years of hands‑on experience with digital schematic build, RTL, or mixed‑signal datapath implementations Preferred Qualifications Strong understanding of HBM/DRAM architectures, including read/write data flow, timing, and multi‑channel operation Working knowledge of layout and floorplanning considerations for high‑speed datapath Experience with static timing analysis (STA) and timing‑closure methodologies Familiarity with advanced process‑node challenges related to signal integrity, skew control, and power optimization Job Profile(s) Systems Design Engineer 4 Relocation Level TBD Benefits Micron offers a choice of medical, dental and vision plans across all locations, allowing team members to select the plans that best meet their family healthcare needs and budget. Additional benefit programs protect income in case of illness or injury and provide paid family leave. Micron also provides a robust paid time‑off program and paid holidays. Equal Opportunity Employer Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr Micron Technology, Inc
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$146k - $309k
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Micron Technology, Inc. is looking for a SoC Design Engineer in Richardson, Texas. In this role, you will design and implement RTL for HBM logic die, collaborating with various teams to ensure robust solutions. A minimum of 10 years in the field, along with a relevant degree...- ...MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs. Integrate and implement complex... ...Preferred Qualifications Experience with HBM / DRAM adjacent SoC designs, or... ...or master’s degree in electrical engineering, Computer Engineering, or a...Local areaRelocationNight shift
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