EE/Electronics Engineer - IC/Semiconductor Failure Analysis

IC/Electronic Failure Analysis Engineer - MID Level and UP!Location - Santa Clara / San Jose, South Bay Area, CaliforniaEmployment Type - Full-Time/Direct Hire/PermWork Environment - Onsite ( NO Remote/Hybrid options) Work is Laboratory based PLEASE REACH OUT if this role is a fit for your skill-set, career goals and the time is right for a move...You can apply to this role and email me directly at View email address on click.appcast.io and I will be in touch to discuss further.A well-established independent engineering and testing organization is seeking a Electrical Engineering degreed and focused, Failure Analysis Engineer/ Electronic Failure Analysis Engineer to join our growing fault isolation and investigation team. This laboratory supports a broad range of customers across the semiconductor, electronics, aerospace, industrial, medical, and advanced technology sectors through specialized third-party testing, analysis, and engineering services.This is a highly visible, and growth oriented role, open to a mid to senior level engineer with an electrical engineering foundation and IC, Electronics and semiconductor failure analysis expertise, ideally with a heavy FAULT ISOLATION profilePLEASE NOTE: This role requires an ELECTRICAL ENGINEERING degree ( BSEE/MSEE ), due to the nature of the daily work done.Position SummaryThe successful candidate will, as part of a team, perform root-cause investigations involving integrated circuits, semiconductor devices, electronic assemblies, and related technologies. These projects f will include work from initial problem definition through fault isolation, physical analysis, root-cause determination, and final reporting.Key ResponsibilitiesConduct comprehensive failure analysis investigations on semiconductor devices, integrated circuits, electronic assemblies, and electromechanical products.Develop and execute analytical strategies to identify electrical, mechanical, manufacturing, and reliability-related failure mechanisms.Perform fault isolation, characterization, and root-cause investigations using advanced laboratory techniques.Analyze production test data, ATE results, schematics, electrical measurements, and device performance information.Support and lead deprocessing activities, sample preparation, package opening, and physical analysis workflows.Review analytical data and ensure the technical accuracy of engineering conclusions and reports.Prepare detailed written reports documenting findings, supporting evidence, conclusions, and recommendations.Present technical results to engineering teams, quality groups, and external customers.Recommend corrective actions and process improvements to improve reliability, yield, and product performance.tion / Required ExperienceBachelor of Science in Electrical Engineering (BSEE) required. (THIS ROLE IS ELECTRONICS FOCUSED - THIS IS NOT A MATERIAL SCIENCE/Materials testing role ) We do have those roles from time to time, but not at this moment.At the core of what experience we are hoping to find includes an EE background, along with direct FA experience and hands-on FA techniques/tools, etc.Ideally experienced engineers will bring some level of FA exposure/experience, particularly familiarly and hands-on on fault isolation techniques:OBIRCH (Optical Beam Induced Resistance Change) - Any specific experience with Hamamatsu systems, such as the PHEMOS-X and iPHEMOS-MPX / iPHEMOS-DDX series would be a plus.XIVA (Externally Induced Voltage Alteration)(IR) Infrared spectroscopy-most commonly used is Fourier Transform Infrared (FTIR)Emission microscopy (EMMI)Other desired skills, experience, and abilities that will confirm you are a good fit, includes:Demonstrated experience investigating failures involving semiconductor devices and electronic components.Strong understanding of semiconductor device operation and failure mechanisms.Experience working with or supporting semiconductor fabrication processes.Knowledge of semiconductor manufacturing, process flows, and device structures.Experience with device physics, characterization, testing, qualification, and performance analysis.Exposure to integrated circuit design, testing methodologies, and device evaluation.Familiarity with semiconductor packaging, package assembly processes, and package-related failure modes.Experience writing, reviewing, and presenting technical reports for engineering and customer audiences.OTHER FA Tools/Analysis experience is also valuable, but not ALL of what is listed is required...There will be a chance to learn just about each and every one of these methods/techniques in this role, depending upon your experience, but if you have more of the list below, we should definitely connect ASAP!Electrical & Fault Isolation TechniquesCurve tracing and electrical characterizationParametric testingOscilloscope-based diagnosticsTime Domain Reflectometry (TDR)MicroprobingLaser-assisted fault isolation techniquesLight Emission Microscopy (LEM)Infrared Microscopy (IR)Emission-based diagnostic methodsPhysical Analysis & CharacterizationScanning Electron Microscopy (SEM)Energy Dispersive Spectroscopy (EDS)Cross-sectioning and microsection analysisX-ray inspectionX-ray Fluorescence (XRF)Destructive Physical Analysis (DPA)FractographyMaterial and construction analysisSample Preparation & DeprocessingFocused Ion Beam FIB analysisDual-Beam FIB techniquesIon millingSample preparation and de-processingPackage opening and layer removal techniquesDye-and-pry investigationsPackaging & Assembly AnalysisBond pull testingBond shear testingAcoustic microscopy - SAM, CSAMPackage integrity evaluationAdvanced package analysisProfessional QualificationsExcellent verbal and written communication skills.Ability to interact effectively with both engineering teams and external customers.Strong technical presentation and report-writing capabilities.Proven ability to manage multiple projects simultaneously while meeting aggressive deadlines.Strong organizational, planning, and prioritization skills.High attention to detail and commitment to technical accuracy.Demonstrated ability to work effectively within a collaborative team environment.Customer-focused mindset with the ability to translate complex technical findings into clear business recommendations.Failure Analysis Engineer, Semiconductor Failure Analysis, Root Cause Analysis, Electronics Reliability, Device Physics, IC Failure Analysis, Electrical Engineering, Fault Isolation, SEM, EDS, FIB, X-Ray, CSAM, TDR, Microelectronics, Reliability Engineering, Semiconductor Packaging, Materials Characterization, Integrated Circuits, Laboratory Engineering, Electronic Test and Analysis.Benefits? Medical, Dental and Vision Coverage? 401k Company Matching? Paid Time Off? Wellness Program? Education AssistancePLUS MANY OTHERS