Senior Materials Engineer: Next-Gen Memory & 3D Packaging
Jobleads-US
Micron Technology, Inc. in Boise, Idaho seeks a Senior Materials Engineer/Scientist to define and enable materials foundations for next-generation memory and advanced packaging technologies, including HBM and 3D memory.
You will develop, characterize, and integrate new materials with cross-functional teams to drive performance, reliability, and cost improvements. The role involves hypothesis-driven experiments, data analysis, and close collaboration with process, product, manufacturing, quality,
#J-18808-Ljbffr Jobleads-USVacancy posted 21 hours ago
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