Process Engineering Technician

Under the direction of the Sr. Director, Thin Film Process Engineering the Thin Film Process Engineering Technician provides support to the engineering teams in the thin film area, assists and supports wafer fabrication, reviews and documents thin film processes or procedures, and dispositions abnormal wafers for rework; maintains process controls using Statistical Process Control (SPC), collects and analyzes data, and recommends corrective action; performs microscopy inspection using various techniques. This position is located in Milpitas, California.

ESSENTIAL FUNCTIONS:

Provides support to the engineering teams in the thin film area Supports wafer fabrication and thin film processes to ensure that wafers are processed efficiently Uses various wafer manufacturing tools such as PVD (Anelva, CVC, PVD, EME, SEED), IBD, CVD, ALD, PECVD, etcher, wet cleaning tool, oven etc., to perform experiments and process wafers Reviews and documents processes and procedures; partners with engineering to implement changes effectively Dispositions abnormal or atypical wafers for rework; ensures that rework is completed promptly Collects and analyzes data and recommends corrective action if required Reviews and maintains process controls using SPC and prepares charts and graphs Performs various types of inspections using microscopes Assists with troubleshooting and resolving process-related issues Participates in and recommends modifications to procedures or processes in support of continuous improvement initiatives Collaborates with engineering to qualify or approve new processes or procedures Creates reports, charts, or graphs on an ad-hoc or routine basis Responds to inquiries from other team members, managers, or departments Adheres to all safety policies and procedures as required Performs other duties of a similar nature or level*

MINIMUM QUALIFICATIONS:

Associates degree in Electronics or Industrial Technology and/or equivalent relevant experience Two years of experience working in the semiconductor industry Knowledge of thin film processes and procedures Proficient in the use of Microsoft Office Applications

REQUIRED KNOWLEDGE, SKILLS, AND ABILITIES:

Knowledge and ability to use various types of microscopes to perform wafer inspection Knowledge of semiconductor or hard disk drive (HDD) principles and processes Knowledge of SPC to maintain process controls Knowledge of thin film processes and procedures Ability to collect and analyze data, present findings, and recommend corrective action Ability to adhere to all safety policies and procedures Ability to communicate effectively with all levels of employees and management Demonstrated ability to follow routine verbal or written instructions Demonstrated problem solving and organizational skills Demonstrated time management and prioritization skills Skilled at resolving issues quickly and efficiently Flexible and able to prioritize The hourly rate for this full-time position is between $26.00-$35.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The hourly pay range shown is subject to change and may be modified periodically.

WORKING CONDITIONS:

The Thin Film Process Engineering Technician works primarily in an indoor environment on a rotating schedule for E shift, Monday-Wednesday every other Thursday 12:00 PM-12:00 AM. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of work day; Stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 20 pounds. *Other duties of a similar nature or level are duties that may be required but may not be specifically listed in the job description or posting.

EEO STATEMENT:

TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, sex, national origin, age, disability, or genetics. #J-18808-Ljbffr Headway Technologies