TSMC Arizona - Process Integration Engineer

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate it’s leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future. TSMC Arizona is seeking a Process Integration Engineer (PIE) for a pivotal role dedicated to ensuring customers achieve success throughout the full lifecycle of their products. This includes New Product Introduction (NPI), device performance, yield, and reliability, leveraging our most advanced technology. Engage your passion for semiconductors and engineering by utilizing cutting-edge, agile, and intelligent operating systems to drive manufacturing excellence. Collaborate with fellow innovators across device, product engineering, lithography, etch, and thin films process teams to identify integrated process solutions that address customer issues or specific requests. Your contributions will be instrumental in achieving exceptional outcomes for our customers. Applicants must be legally eligible to work in the United States and have: 1. Bachelor's or higher degree in Electrical Engineering, Material Science or Physics. 2. Experience in leading the improvement of the silicon process flow Including front-end-of-line (FEOL), middle-end-of-line (MEOL), and back-end-of-line (BEOL). 3. Experience with process shifts, changes with design rules and product layout with individual process steps and their impact on Function Yield, Electrical Test and Product Performance as well as short- and long-term reliability implications. 4. Good communication and interpersonal skills. 5. Able to work on cross-functional and geographically dispersed teams with diverse backgrounds. 6. A team player that can multitask and thrive in a very dynamic and fast-paced environment. #J-18808-Ljbffr TSMC - Taiwan Semiconductor Manufacturing Company Limited