Sign up to access all features of our service.
  • Job search
  • Favorites
  • Create a CV
    New
  • Salaries
  • Subscriptions

Packaging Module Development Engineer

$115.11k - $219.55k
Full-time

Intel Corporation

Job Details:

Job Description:

The Advanced Packaging Technology and Manufacturing (APTM) organization is seeking a Metrology Equipment Engineer to drive process control, manufacturing data analytics, and yield improvement for Thermal Compression Bonding (TCB) technologies.

The successful candidate develops and sustains metrology systems, measurement methods, and inspection equipment to support Intel’s roadmap for advanced packaging and Thermal Compression Bonding technologies. They apply engineering principles and novel concepts to deliver measurement solutions that improve process control, product quality, reliability, productivity, yield, and manufacturability.

What You’ll Do

Key responsibilities will include but not limited to:

  • Optimizes metrology capability across laboratory and manufacturing environments by developing and qualifying measurement processes, equipment specifications, calibration methods, and correlation techniques.
  • Uses design of experiments, statistical analysis, and measurement system analysis to improve repeatability, reproducibility, and consistency across tools, sites, and product generations. Documents technical findings and improvements through white papers, reports, and qualification summaries.
  • Establishes measurement specifications and collaborates with equipment suppliers, internal development teams, quality, process, and manufacturing organizations to ensure measurement capability, traceability, and data integrity meet program needs.
  • Provides technical consultation on measurement challenges, equipment issues, lab-to-factory correlation, and metrology process improvements.
  • Supports standardization of metrology methods, and works closely with packaging technology development, process engineering, and partner engineering groups to assess readiness and meet product milestones.

​

Behavioral traits that we are looking for:

  • Strong analytical and problem-solving skills.
  • Ability to lead complex technical initiatives and influence cross-functional teams.
  • Excellent communication and collaboration skills.
  • High ownership, accountability, and execution focus.
  • Passion for innovation and continuous improvement.

Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.

  • See Intel Benefits for more details.

Qualifications:

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Note:

For information on Intel’s immigration sponsorship guidelines, please see

Intel U.S. Immigration Sponsorship Information

Minimum Qualifications and Experience:
  • Bachelor's degree in Electrical Engineering, Mechanical Engineering, Physics, Metrology, Instrumentation, Optical Engineering, or a related engineering discipline with 4+ years of experience. Or a Master's degree in the same filed with 3+ years of experience or a PhD in the same filed with 1+ years of educational or work experience.
  • Your experience describe above must be in the following:
    • Experience in metrology systems development, measurement equipment qualification, calibration, and/or measurement method development in a manufacturing, lab, or engineering environment.
    • Measurement system analysis (MSA), including bias, linearity, stability, repeatability, and reproducibility.
    • Experience with electrical measurements and test, such as continuity, resistance, leakage, signal integrity basics, or related parametric test methods.
    • Experience with optical metrology, including microscopes, imaging systems, inspection methods, and/or machine vision.
    • Data analysis tools such as Python, Excel, SQL, or similar tools for measurement analysis and reporting.

Preferred Qualifications and Experience:

  • Experience in semiconductor manufacturing, preferably in advanced packaging.
  • Experience developing or sustaining metrology systems for process control, product qualification, or reliability evaluation.
  • Strong background in equipment selection, tool qualification, acceptance testing, and calibration traceability.
  • Experience with machine vision systems, automated inspection, or camera-based measurement techniques.
  • Familiarity with lab-to-factory correlation, tool matching, and cross-tool measurement agreement studies.
  • Experience with DOE, correlation analysis, and method optimization for metrology or test systems.
  • Knowledge of quality systems, measurement documentation, and standardization of metrology methods.
  • Experience working with suppliers, vendors, or external calibration/measurement service providers.
  • Demonstrated ability to analyze measurement data using statistical methods to identify variation, correlation issues, tool drift, and root causes.

Why Intel

Join a team developing breakthrough packaging technologies that power the world's most advanced computing products. You'll work with industry-leading experts, solve challenging technical problems, and directly influence the future of semiconductor manufacturing.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Vacancy posted 2 days ago
Similar jobs that could be interesting for youBased on the Packaging Module Development Engineer in Chandler, AZ vacancy
  • $85.2k - $162.5k

     ...computing, connectivity, and intelligence. With decades of engineering excellence and a commitment to pushing the boundaries of...  ...one? Intel's Epoxy MEOS team in Arizona is looking for a Packaging Module Development Engineer to join our growing team of packaging technology... 
    Suggested
    Full time
    Internship
    Local area
    Immediate start
    Shift work
    Night shift

    Intel Corporation

    Chandler, AZ
    2 days ago
  • $90k - $110k

     ...Semiconductor Process Development Engineer – Advanced Packaging Location: Chandler, Arizona – Onsite Salary: $90,000–$110,000 + 5% Bonus + Benefits Travel: Approximately 25–30% Below, you will find a complete breakdown of everything required of potential candidates... 
    Suggested

    Delve Search - Global Search Consultants

    Chandler, AZ
    4 days ago
  • The Semiconductor Packaging Engineer will serve as an experienced technical lead within NXP’s Package...  ...experience in semiconductor packaging development, package technology, assembly process...  ..., FCCSP, WLCSP, FOWLP, FOPLP/PLP, SiP/modules, and power packages.Experience leading... 
    Suggested
    Full time
    Work at office
    Local area

    NXP Semiconductors

    Chandler, AZ
    2 days ago
  • $128k - $176k

     ...Materials is a global leader in materials engineering solutions used to produce virtually...  ...technical lead for complex application development activities, customer engagements, and cross...  ..., metrology, testing, or advanced packaging applications strongly preferred.Experience... 
    Suggested
    Full time

    Applied Materials

    Chandler, AZ
    4 days ago
  •  ...Company Description Pacific Packaging (PPC), founded in 1970, is a pioneering packaging...  ...full-time remote role for a Packaging Engineer. The Packaging Engineer will be...  ...packaging solutions, conducting research and development (R&D), and managing projects from concept... 
    Suggested
    Full time
    Remote work
    Flexible hours

    Pacific Packaging

    Chandler, AZ
    2 days ago
  •  ...people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community,...  ...integrity and PCB thermal analysisFamiliarity with Mechanical CAD package (SOLIDWORKS, Autodesk Fusion/Inventor) or equivalentAbility to... 
    Full time
    Contract work

    Microchip Technology

    Chandler, AZ
    5 days ago
  •  ..., linearity, and repeatability• Working with cross-functional engineers at product concept to properly define characterization/validation...  ...or higher (MSEE preferred) and a minimum of 5 years of test development experience on ATE with high performance integrated circuits•... 
    Full time
    Work at office
    Local area

    NXP Semiconductors

    Chandler, AZ
    3 days ago
  • $128.8k - $193.2k

     ...cross-functional collaboration as we work together to engineer the extraordinary.This Principal Process Development Engineer will be responsible for the development...  ...applications, including laser selection, optics package selection and ideally in joining, cutting, and markingExperience... 
    Full time
    H1b
    Work at office
    Local area
    Immediate start
    Flexible hours

    Medtronic

    Tempe, AZ
    5 days ago
  •  ...Tittle: Product Development Engineer Duration: 06 Months Location: Tempe AZ, 85281 Job description: ~ Provide...  ...into engineering requirements for specific product, packaging and process specifications. ~ Engineer robust and manufactural... 
    Local area

    Tricehealthcare

    Tempe, AZ
    4 days ago
  • $198.1k - $268k

     ...career challenge? We seek an experienced Electronics Engineer specializing in PCB Silicon packaging co-design to join Arm’s Packaging, Boards and...  ...develop physical hardware platforms used for software development and validation activities for both external partners... 
    Work at office
    Local area

    ARM

    Chandler, AZ
    2 days ago
  •  ...Renesas is expanding its advanced packaging capabilities and seeking a...  ...Staff Package Design Engineer to join our Advanced Silicon...  ...IC design, advanced package development, and system-level implementation...  ...solutions, including power modules, chiplet-based architectures... 
    Shift work

    Renesas Electronics America

    Tempe, AZ
    3 hours ago
  •  ...DescriptionDesign and develop package and interconnect methods for...  ...in the areas of Power SiP/modules, flip-chip LGA, multi-chip module...  ...in packaging roadmap development & focus on execution. Address...  ...Mechanical, Electrical or Materials Engineering. • 10-15 years of relevant... 
    Contract work
    For subcontractor

    Renesas Electronics America

    Tempe, AZ
    5 days ago
  •  ...and supply to create a competitive advantage for our customers.Package Innovation delivers IC packaging solutions and new packaging...  ...capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.More... 
    Full time
    Work at office
    Local area
    Flexible hours

    NXP Semiconductors

    Chandler, AZ
    4 days ago
  • $19 per hour

     ...Packaging AssociateSchedule: Monday - Friday 6am - 2:30pm (Need to confirm)Pay Rate: $19/hourPosition Overview: Our client is seeking a detail-oriented, reliable Packaging Associate to join their team. In this role, you will assemble, inspect, and package materials efficiently... 
    Work at office
    Monday to Friday
    Day shift
    Afternoon shift

    PrideStaff

    Chandler, AZ
    4 days ago
  •  ...Shape the Future of Wellness – Join the Gummi World Packaging Team! At Gummi World, we manufacture more than just great-tasting gummies — we create health and wellness solutions that people trust. Based in Chandler, Arizona, we’re a fast-growing nutraceutical company... 
    Currently hiring
    Immediate start

    Gummi World

    Chandler, AZ
    2 days ago
  • $20 per hour

     ...Packaging Specialist - Chandler, AZ Pay: $20.00 per hour Schedule: Monday-Thursday, 6:00 AM-4:30 PM Location: Chandler, AZ - near 56th St & Willis Rd Responsibilities Pull, assemble, package, label, and ship aircraft parts Follow quality paperwork,... 
    Hourly pay
    Temporary work
    Local area

    Adecco US, Inc.

    Chandler, AZ
    6 hours ago
  •  ...Mesa, AZ facility for a Manufacturing Technician within our Packaging group! The Role This role performs critical tasks such as...  ...your future. We have six U.S. manufacturing and Research & Development facilities, located in: Mesa, Arizona; Castroville, California... 
    Full time
    Local area
    Shift work
    Night shift
    Day shift
    Afternoon shift

    FUJIFILM Biotechnologies

    Mesa, AZ
    a month ago
  • Job DescriptionResponsibilities:Lead package technology development and NPI execution, including R&D...  ...Stages, Vertical Power Stages, Power Modules, and discrete FET packages.Support wide...  ...maintain package design rules and engineering standards.QualificationsMaster’s or... 
    Contract work
    For subcontractor

    Renesas Electronics America

    Tempe, AZ
    2 days ago
  • $51.71k - $99.77k

     ...Assembly And Test Technology Development Engineer We are part of the assembly and test technology development team based in Chandler, supporting advanced electronic packaging technology development. Our team directly supports quality and reliability failure analysis... 
    Hourly pay
    Local area
    Immediate start
    Shift work

    Intel

    Chandler, AZ
    4 days ago
  •  ...Summary Tessolve is hiring 4 IC Packaging Design Engineers based in Chandler, AZ (primary) or Hillsboro, OR (secondary). We're looking for senior-level talent (10+ years) primarily, with mid-level (4–6+ years MS / 6+ years BS) candidates also considered. About the... 
    Part time
    Work at office
    Worldwide
    Flexible hours

    Tessolve

    Chandler, AZ
    2 days ago
  •  ...manufacturing, prototyping, and repair services, specializing in the development and production of innovative technological solutions. From...  ...essential   What We Offer: Comprehensive benefits package consisting of Medical, Dental and Vision. Praxis Resources contributes... 
    Hourly pay
    Full time
    Temporary work
    Immediate start
    Monday to Friday
    Shift work
    Afternoon shift

    Praxis Resources Inc

    Gilbert, AZ
    15 days ago
  • $99.2k - $148.8k

     ...functional collaboration as we work together to engineer the extraordinary. This is a...  ...Arizona. Our campus is a technology development centers where we help design manufacture...  ...Salary and flexible Benefits Package A commitment to our employees lives at... 
    Full time
    For contractors
    Work experience placement
    H1b
    Work at office
    Local area
    Immediate start
    Flexible hours

    Medtronic

    Tempe, AZ
    7 days ago
  •  ...Principal Process Development Engineer leading laser-based manufacturing process development from conception through production release. Responsibilities...  ...with laser applications including selection, optics packages, joining, and cutting Statistical analysis and design of... 

    Medtronic

    Tempe, AZ
    11 days ago
  • $185.2k - $250k

     ...help our customers change the world.We are seeking a Sr. Package Layout Engineer to lead the end-to-end physical design of advanced IC packages...  ....- Mentor junior layout engineers and contribute to the development of team best practices, automation flows, and design reuse... 
    Local area
    Flexible hours

    Amazon

    Tempe, AZ
    5 days ago
  •  ...junior software developer, product manager, or designer to join our team. Your primary role will be building products on our no-code development platform, so while a technical background would be helpful, it is not required. What is most important is a strong product sense.... 
    Work at office

    Devize

    Gilbert, AZ
    2 days ago
  •  ...Job Description Job Description UAS Development Engineer – Fixed-Wing Aircraft Company: Undisclosed Location: Tempe, AZ Compensation: Competitive, based on experience Position Must be willing to undergo a background check Must be a U.S. Citizen... 
    Local area
    Remote work

    Undisclosed

    Chandler, AZ
    6 days ago
  • $60.45k - $85.34k

     ..., conducting technical investigations, and collaborating with engineering teams to improve manufacturing performance and product quality...  ...Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive... 
    Hourly pay
    Local area
    Immediate start
    Shift work

    Intel Corporation

    Chandler, AZ
    4 days ago
  • $164.47k - $232.19k

     ...As a Semiconductor Research Engineer, you will drive scientific innovation...  ...developing novel devices, packages, and interconnects using...  ...leverages cutting‑edge research and development efforts to ensure Intel...  ...solutions across production modules, such as lithography, etch, diffusion... 
    Local area
    Immediate start
    Shift work

    Intel

    Chandler, AZ
    4 days ago
  • $21 per hour

     ...5S guidelines.Cross-train and flex across functions based on development and business needs.Qualifications:Basic:Minimum one year of experience...  ...crane, template/fixtures, hand carts, tape measure, storage/packaging materials and prescribed safety equipment.Skills:Position... 
    Hourly pay
    Weekly pay
    H1b
    Local area
    Visa sponsorship
    Relocation package
    Flexible hours

    Eaton Plc

    Chandler, AZ
    5 days ago
  •  ...Manufacturing Technician supports sterile injectable manufacturing operations by performing aseptic production, filling, compounding, packaging, and documentation activities in a controlled cleanroom environment. This role ensures compliance with FDA regulations, cGMP... 

    Medivant Healthcare

    Chandler, AZ
    3 days ago

Do you want to receive more vacancies?

Subscribe and receive similar vacancies to Packaging Module Development Engineer. Be the first to apply!