ASIC Package Eng Intern/Co-op — Design & Yield
Advanced Micro Devices, Inc.
AMD invites you to join our ASIC Packaging team as a co-op/intern, working 40 hours a week in a hybrid or onsite structure. You will contribute to substrate, interposer and bump designs, support design verification, and help improve yield through data analytics and material benchmarking. This role offers exposure to next-gen packaging tech, collaboration with engineers, and hands-on project experience in a dynamic semiconductor environment. #J-18808-Ljbffr Advanced Micro Devices, Inc.
Vacancy posted 2 days ago
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