Lab Technician

Title: Lab Technician
Location: Palo Alto, CA (Onsite)
Duration: 6 months + (possibility of an extension)
Implementation Partner: Infosys
End Client: To be disclosed


JD:


Exp in yrs : 2 to10+ yrs


Primary Skill set : Prototyping/3d printing/ assembly


Secondary Skill :
Lab Layout & Organization: - Facilitate layout discussions and support proposals. - Organize and execute layout changes in accordance with "5S principles" (i.e., sort, set in order, shine, standardize, and sustain). - Optimize storage for materials, equipment, and finished goods. 3 of 9


Equipment & Maintenance: - Track equipment health and implement preventative maintenance. - Maintain equipment readiness for prototyping. - Communicate with Wing designated team members regarding equipment status for production planning.


Inventory & Production Support: - Track material inventory and manage restocking. - At Wing's request, assist with or execute on production queue management and production. - Support manufacturing methods and processes. 4.4 Contract Manufacturers ("CM") Supplier Development Engineer ("SDE") Services


Communication & Collaboration: - Communicate effectively with US-based process and design teams. - Serve as liaison between Wing and CMs by interfacing with their project management and technical teams.


New Product Introduction ("NPI") & Manufacturing Support: - Execute NPI and sustaining requests from Wing. - Oversee new process introduction, identify and solve issues, and validate solutions for manufacturing lines. - Identify process variables, controls, and root causes of issues. - Own design of experiments with input from engineering teams. - Identify and implement process improvements.


Project & Risk Management: - Track requests, schedule, and prioritize workload for and between Contractor and CM. - Identify and communicate risks to Wing's designated personnel.


Manufacturing Methods & Processes: Provide technical solution for various manufacturing processes, including soldering, conformal coating, injection molding, adhesive activation (i.e. liquid, film/tape, ultraviolet cure), surface mount technology and reflow, inspection (i.e. automated optical inspection, coordinate measuring machine), Instron testing (i.e. tensile, peel, 3-point bend, 4-point bend), and bond strength testing (i.e. dyne, water contact angle, peel)