Electro Mechanical Engineer

Location: Orlando, FL Salary: $80.00 USD Hourly - $90.00 USD Hourly Description:
Electro Mechanical Engineer

About the Role

We are seeking an experienced Electro Mechanical Engineer to support the design, development, and qualification of advanced electronic hardware systems for aerospace and defense applications. This is a hands-on engineering role focused on electromechanical design, advanced packaging, thermal management, microelectronics, and high-reliability hardware development . This is not a CAD/Drafting-only position .

The ideal candidate will possess deep expertise in 3D Heterogeneous Integration (3DHI), advanced packaging technologies, microelectronics design, and electromechanical system development , along with demonstrated technical leadership throughout the product lifecycle.

Key Responsibilities

• Design and develop advanced electromechanical hardware solutions, including multichip packages, circuit card assemblies, cable assemblies, interconnects, and subsystem hardware.
• Design package substrates, integrated heat spreaders, stiffeners, attachment mechanisms, and thermal management solutions for high-power electronic systems.
• Perform and support thermal, mechanical, structural, signal integrity, and reliability analyses using simulation and modeling tools.
• Collaborate with cross-functional engineering teams to develop and validate multiphysics Finite Element Analysis (FEA) models for thermal cycling, vibration, shock, and mechanical stress.
• Define and execute product qualification plans in accordance with industry and military standards, including JEDEC and MIL-SPEC requirements.
• Conduct root cause investigations and failure analysis on electronic packaging and interconnect technologies, including solder joints, delamination, substrate warpage, and related reliability concerns.
• Lead design reviews, document engineering decisions, track action items, and implement corrective actions through closure.
• Develop advanced circuit card packaging solutions that meet performance, size, weight, power, reliability, and environmental requirements.
• Coordinate with systems, software, test, manufacturing, quality, and supply chain teams to ensure successful program execution.
• Support program planning, risk management, scheduling, cost estimation, earned value management (EVM), and technical reporting activities.
• Capture and manage engineering requirements, including flowed-down and derived requirements, throughout the system development lifecycle.

Required Qualifications

• Bachelor's Degree in Electrical Engineering, Mechanical Engineering, Aerospace Engineering, or a related STEM discipline from an accredited institution.
• Master's Degree or PhD preferred.
• In lieu of a degree, a minimum of 15 years of relevant Electromechanical Engineering experience will be considered.

Required Experience

• Minimum 11 years of experience in Electromechanical Engineering or related disciplines.
• Hands-on experience with 3D Heterogeneous Integration (3DHI) technologies.
• Strong background in Advanced Packaging and microelectronics hardware development.
• Experience with Microelectronics Design and high-reliability electronic systems.
• Proficiency with CREO for modeling and electromechanical product design.
• Experience performing or supporting FEA, thermal analysis, structural analysis, and reliability assessments .
• Technical leadership or project leadership experience supporting the development and production of complex electronic hardware products.
• Experience managing engineering projects through the full lifecycle, including planning, staffing, budgeting, scheduling, execution, tracking, and EVM.
• Strong verbal, written, and presentation communication skills.
• Experience working effectively with distributed, cross-functional engineering teams.
• Experience capturing, managing, and validating engineering requirements for electromechanical designs.

Preferred Qualifications

• Experience with aerospace, defense, missile, sensor, or high-reliability military electronics programs.
• Familiarity with JEDEC, MIL-STD, MIL-SPEC, and HAST qualification methods.
• Experience supporting hardware qualification, environmental testing, and reliability engineering initiatives.
• Knowledge of thermal management, signal integrity, electromagnetic compatibility (EMC/EMI), and packaging technologies for harsh operating environments.

Medical, dental, and vision insurance are available to qualified candidates who meet eligibility requirements.
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