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Chief Product Engineer - Audio Technology

$205.8k - $282.9k

Bose

At Bose Corporation, we believe sound is the most powerful force on earth — and for over 60 years, we have been a company built on innovation, excellence, and independence. Privately owned, fiercely customer-focused, and driven by our values, we continue to lead industries and transform lives through sound. Today, Bose Corporation is entering an exciting new era. Across multiple global Business Units and Global Functions, we are shaping the future of audio technology, automotive, luxury, and premium experiences. We invite you to join us in this transformation. Job DescriptionThe Chief Product Engineer serves as the top technical leader responsible for aligning product engineering with product, intellectual property (IP) and licensing strategies. This role bridges core research and development (R&D) with external commercialization, ensuring that engineered systems are modular, documented, and legally robust for third-party adoption or joint ventures. As the principal technical architect responsible for the creation, protection, and commercial transfer of our proprietary consumer audio and hearables technology. You will ensure that our patented algorithms, hardware / software architectures, and software stacks (e.g., ANC, spatial audio, voice pickup, wireless connectivity) are packaged into robust, modular, and easily integrable Reference Designs or Intellectual Property (IP) blocks for third-party consumer electronics brands and ODMs.Key Responsibilities:Licensing Architecture Strategy: Define and design the technical boundaries of our licensing portfolio (IP blocks, SDKs, reference hardware). Ensure audio technologies are modular and seamlessly integrate into diverse host chipsets (Qualcomm, Bestechnic, MediaTek, etc.).DSP Platform Integration: Oversee the optimization and integration of audio code libraries across leading wireless audio SoC and DSP platforms (e.g. Cadence Tensilica HiFi DSPs etc.).Technical Package Delivery: Oversee the development of comprehensive Technical Data Packages (TDPs). This includes golden reference designs, tuning tools and software, comprehensive SDKs, APIs and bit-exact reference models, acoustic design guidelines, DSP code libraries, and documentation for licensee onboarding.Tuning & Tooling Development: Champion the creation of developer-facing software tools and GUI-based tuning utilities that empower licensees to calibrate ANC, EQ, and spatial audio parameters to their specific acoustic hardware.Partner Evaluation & Integration Support: Act as the primary technical authority during licensing evaluations. Provide deep-dive technical support, reference tuning, and architectural reviews for tier-1 consumer electronics licensees and manufacturing partners (ODMs).IP Protection & Compliance: Partner with the Legal and IP teams to identify patentable innovations in hardware, firmware, and acoustic architectures. Develop technical validation methodologies and tools to audit and verify licensee compliance.Cross-Functional Leadership: Mentor a highly specialized team of audio, DSP, firmware, and hardware engineers, steering their R&D output toward scalable, high-margin licensing platforms rather than single bespoke products.Required Skills & QualificationsExperience: 12+ years in consumer audio, acoustics, or hearables product development (e.g., TWS earbuds, smart headphones, spatial audio systems), with a heavy emphasis on embedded software and DSP algorithm development. At least 4 years managing software IP delivery, technical transfers, or external licensing integrations.Algorithm & DSP Mastery: Deep expertise in developing and optimizing real-time audio processing software. This includes fixed-point math optimization, assembly-level vectorization (e.g., NEON, Tensilica instruction extensions), and low-latency scheduling.Domain Expertise: Domain mastery over core hearable software pillars: Active Noise Cancellation (ANC/biquad design), Spatial Audio/HRTF, Echo Cancellation (AEC), Wind Noise Reduction, and Machine Learning-based Voice Pickup (VPU). Deep understanding of Bluetooth LE Audio/Auracast, microphone arrays (beamforming), and audio codecs (LC3, LDAC, aptX).Systems & Standards: Strong fluency in C/C++, Python (for modeling), real-time operating systems (RTOS), Bluetooth LE Audio pipelines, Auracast, and standard audio codecs (LC3, AAC, LDAC).Hardware & Acoustic Context: Solid understanding of how software interacts with physical acoustic constraints, including microphone array geometries, transducer frequency responses, and ADC/DAC latency paths.Communication & Negotiation Support: Exceptional ability to present highly complex acoustic and software concepts to non-technical business stakeholders, IP attorneys, and external executive teams.Education: Bachelor’s, Master’s, or Ph.D. in Electrical Engineering, Computer Science, Acoustical Engineering, or a related technical discipline.At Bose, you're inspired to be and do your best and are rewarded for your unique talents! Our compensation is thoughtfully tailored to your skills, experience, education, and location, and goes beyond base salary. The hiring range for this position in the primary work location of Remote, California is: $205,800-$282,900.The hiring range for other Bose work locations may vary. In addition to competitive base pay we offer rewards including bonus programs, comprehensive health and welfare benefits, a 401(k) plan, plus exclusive perks designed to support your wellbeing, and a generous employee discount where you can immerse yourself in our products and experiences. We are a proudly independent company—driven by purpose, guided by our values, and united by a belief in the power of sound. As the world leader in audio experiences, we’re creating what’s next—pushing boundaries and delivering transformative sound experiences for people everywhere. Join us and make your next career move a mic-drop. Let’s Make Waves.‎ SummaryLocation: United States, Work from Home; US, MI - Bloomfield Hills; US, MA - Framingham; US, MI - TroyType: Full time

Vacancy posted 1 day ago
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