Senior Package Engineer - Multi-Die IC Packages + Equity
Delos Data
Delos Data is seeking a Senior Packaging Engineer to architect and deliver advanced multi-die IC packages for high-performance AI accelerators. You will lead package architecture, substrate design, manufacturability, and vendor engagement. Responsibilities include selecting packaging types, defining stack-ups, and coordinating with design teams and foundries to ensure performance and reliability. The role supports bring-up and qualification across next-gen products.
#J-18808-LjbffrVacancy posted 1 day ago
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