Senior SI/PI Engineer - Advanced 2.5D/3D Packaging
Annapurna Labs (U.S.) Inc.
Annapurna Labs (our organization within Amazon) seeks a Sr. Signal & Power Integrity Engineer to join our hardware team and lead SI/PI analysis for advanced packaging in next-generation ML and data-center ASICs. You will own the package-level SI/PI strategy from architecture trade-offs to design closure, collaborating with ASIC, board, and packaging teams to meet performance and manufacturing targets. #J-18808-Ljbffr Annapurna Labs (U.S.) Inc.
Vacancy posted 1 day ago
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