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Engineer

TalentAlly

Vernonia, OR

Intel in the United States is seeking a Senior HBI Module Development Engineer to drive die-to-wafer hybrid bonding equipment development and manufacturability for next-generation packaging technologies. You will influence reliability, yield, and process maturity across development and high-volume manufacturing environments. You will lead DOE studies, engage with suppliers, and collaborate with cross-functional teams to push forward technology roadmaps for advanced packaging in AI and HPC #J-18808-Ljbffr

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Vacancy posted 3 days ago
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