Process Integration Engineer

An advanced semiconductor manufacturing organization is expanding its technology development team and is seeking an experienced BEOL Process Integration Engineer to support next‑generation process platforms. This role sits at the intersection of research, development, and high‑volume manufacturing, with direct ownership of back‑end‑of‑line integration for advanced lithography nodes. About the Role You will play a critical role in translating novel process concepts into manufacturable, production‑ready technologies. Working cross‑functionally with lithography, unit process, reliability, and packaging stakeholders, you will help shape scalable BEOL solutions that meet demanding performance, yield, and reliability objectives. This opportunity is well‑suited for engineers who thrive in technically complex environments and want to influence the future of advanced semiconductor technologies. Responsibilities Lead end‑to‑end BEOL integration strategies to achieve electrical, physical, yield, and reliability targets at advanced technology nodes Define and optimize process flows through structured experimentation in partnership with unit process development teams Collaborate with lithography and modeling specialists to validate patterning solutions and drive continuous improvements Ensure BEOL integration aligns with downstream test, assembly, and packaging robustness requirements Drive execution against aggressive development schedules while balancing technical risk, manufacturability, and cost Communicate technical progress, trade‑offs, and decisions clearly to cross‑disciplinary stakeholders Qualifications Master’s degree in Electrical Engineering, Materials Science, or a closely related technical discipline Minimum of 5 years of hands‑on experience developing BEOL processes at advanced technology nodes (28nm and below) Required Skills Strong background in process integration, experiment design, and data‑driven decision making Experience with advanced BEOL elements such as resistive memory, thin‑film resistors, or metal‑insulator‑metal capacitors is advantageous Demonstrated ability to manage multiple parallel workstreams and deliver results under tight timelines Proven track record of cross‑functional collaboration in complex engineering environments Clear, confident written and verbal communication skills Self‑driven mindset with strong analytical, problem‑solving, and organizational capabilities Preferred Skills Doctoral degree in a relevant field is a plus but not required Pay range and compensation package Competitive compensation and comprehensive benefits #J-18808-Ljbffr