Packaging Module Development Engineer

Job Details:Job Description: We are seeking a highly motivated, self-driven individual to join Materials Technology Development (MTD), bringing a strong technical background and a demonstrated ability to collaborate effectively across cross-functional teams to drive materials technology development for advanced packaging. The ideal candidate will have a strong educational foundation in Materials Science, such as Metallurgy or Polymer Science or Polymer Chemistry, with an excellent understanding of structure-property-performance correlations in materials and strong functional knowledge of materials characterization tools and techniques. The candidate must be able to apply sound technical problem-solving skills to resolve materials-process-equipment challenges in technology development and drive innovative materials solutions for advanced packaging at Intel. This role requires close collaboration with cross organizational stakeholders to deliver novel materials technologies that meet stringent quality and reliability requirements. The candidate must also be able to work effectively with external materials suppliers and possess strong communication and presentation skills, including the ability to formulate and present materials strategies and development plans in both internal and external forumsNote: This role requires regular onsite presence to fulfill essential job responsibilities.Key Responsibilities:Develops assembly materials, processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.Optimizes and improves the efficiency of manufacturing of packages, developing innovative materials, processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.Develops materials target specifications to ensure excellent integration of materials into packaging equipment and processes meeting quality and reliability targets.Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure materials technology, quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging materials quality and reliability.Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.Leads efforts towards innovating, problem solving, developing, and continuously improving materials, equipment and processes using experimental design and statistical methods.Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on materials/process/technology maturity for products towards key risk areas in meeting product milestones.Qualifications:You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.Minimum Qualifications:Bachelor's degree with 4+ years of experience or Master's degree with 3+ years of experience or Ph.D in a relevant field such as Materials Science, Metallurgy, Chemical Engineering, Chemistry, Mechanical Engineering, or a related discipline.4+ years of hands-on experience in packaging module development, process characterization, or equipment optimization.Preferred Qualifications:Experience in collaborating with cross-functional teams, suppliers, and manufacturing operations to achieve shared goals.Proficiency in Design of Experiments (DOE) principles and statistical data analysis tools.Demonstrated expertise in packaging fundamentals, package design and development, and package testing methodologies.Knowledge of reliability and quality requirements for semiconductor packaging.Knowledge of materials structure-property-performance behaviors and materials characterization techniques is highly preferred.We are excited to welcome passionate engineers who thrive on innovation, collaboration, and driving advancements in technology. If you are ready to make an impact and help shape the future of semiconductor packaging, we invite you to apply today.Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.SummaryLocation: US, Oregon, HillsboroType: Full time