Senior Product Engineer, Product Engineering

ID lavoro: 10460505 | Amazon Kuiper Manufacturing Enterprises LLC

Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.

The Role:

As Senior Semiconductor Product Engineer, you will engage with an experienced cross-disciplinary staff to conceive, design, and manufacture innovative semiconductor solutions for Leo’s satellite and ground terminal products. You will work closely with internal inter-disciplinary teams and third-party suppliers to drive key aspects of semiconductor product manufacturing, test, qualification, and reliability to meet our customers’ needs. You must be responsive, flexible and able to succeed within an open collaborative peer environment.

In this role you will:

• Review system and product specs and define appropriate stage-gate criteria with TE for product development and qualification.
• Review process & technology selection for product, based on application, design architecture and identify key risks.
• Collaborate with packaging team in reviewing package design, configuration and BoM choices. Incorporate product-package considerations into char & qual plans.
• Develop & execute de-risking strategies to address technology risks to product development.
• Drive test program reviews with design, test, DVT and system teams.
• Define test plans & test coverage for production lots, corners lots, and pre-/post-qualification based on system specs, and yield & Cpk targets.
• Collaborate with TE to develop & evaluate test program, and proto-Si bring-up.
• Analyze foundry WAT data from development, corner lots and qual lots.
• Define char plans for corner lots in conjunction with design, DVT and systems and in alignment to mission profile and system specs.
• Execute char data collection and analysis on corner lots across voltage and temperature.
• Assess gaps in & drive alignment between ATE and bench test programs and drive resolution of mismatch between ATE & bench results.
• Analyze bench-ATE correlation data and implement appropriate offsets / transforms to ATE data to match back to golden bench results.
• Complete char data analysis to derive guard bands for production test program and confirm compliance to system specs.
• Work with design / TE to identify bugs, and support fixes during product bring-up.
• Design & execute GR&R data collection on initial test hardware set‑ups to demonstrate gauge capability to product specs – drive follow‑up actions such as test program de‑bug, spec relaxation with system team as appropriate.
• Drive test-time reduction by AI & ML techniques such as RF-DC and FT-WS correlation and reject‑oriented analysis, optimizing for test coverage, quality, yield & cost.
• Define qual plans based on evaluation of mission profile and execute to defined qual plans, projecting FIT rate and dppm estimates based on technology parameters, system application & product lifetime targets.
• Identify root cause and drive fixes for any failures reported during qual.
• Publish comprehensive product qualification, characterization and release to production documentation for review and approval by relevant stakeholders.

Export Control Requirement:

Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Key job responsibilities

Review system spec and align with system, design, DVT and test teams on test coverage. Define stage gate flow from product definition through release to production phases. Validate and confirm gauge capability across initial hardware set‑ups for test solutions developed to system spec. Drive characterization and product bring‑up. Correlate ATE data to bench results, defining correlation criteria and de‑bugging cases of poor fit across platforms. Assess process and package technologies, identifying key concerns & developing de‑risking & validation strategies to address by interlinking product dependencies. Define process corners, package evaluations and verifying production readiness across entire supply chain. Finalize production ATE specs for test program and complete buy‑off from system, design and operations teams. Complete qualification and release to production meeting target yield and Cpk numbers.

A day in the life

Collaborate with DVT, design and test teams on working through product and test issues. Work with packaging team, OSAT and foundry to address any open engineering items. Track product bring‑up and introduction to schedules with TPM teams. Run data analyses on product GRR, char and bench‑ATE. Design and run corner lots in fab and through assy & test. Review qual results and run drift analysis.

About the team

A highly experienced team of product engineers with breadth across RF & digital products, data analysis & ML, automation and software solution development, and in-depth understanding of process & package technologies, and SOC solutions.

Qualifications

• Bachelor's degree in Electrical/Communications Engineering, or experience working in electrical engineering field
• 10+ years in semiconductor product engineering or foundry process operations, preferably in high-volume wireless SoC devices manufacturing.
• Up to 20% domestic or international travel required.
• Masters or PhD degree in Electrical / Communications Engineering or related field.
• Excellent oral and written communications skills.
• RF product development and characterization experience.
• Knowledge of digital and Serdes testing.
• Experience interfacing with suppliers and external partners.
• Proficiency in statistics, data analysis and YMS products such as Exensio and JMP – scripting skills preferred.
• New product introduction, with transition from design phase, through qualification and into high volume manufacturing environment.
• Conversant with failure analysis techniques such as FIB, SEM, IR, EMMI, and CSAM.
• Knowledgeable with package technologies such as FCBGA, FCCSP, WLCSP, and QFN.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.

Qualifiche Preferenziali

• Masters or PhD degree in Electrical / Communications Engineering or related field.
• Excellent oral and written communications skills.
• RF product development and characterization experience.
• Knowledge of digital and Serdes testing.
• Experience interfacing with suppliers and external partners.
• Proficiency in statistics, data analysis and YMS products such as Exensio and JMP – scripting skills preferred.
• New product introduction, with transition from design phase, through qualification and into high volume manufacturing environment.
• Conversant with failure analysis techniques such as FIB, SEM, IR, EMMI, and CSAM.
• Knowledgeable with package technologies such as FCBGA, FCCSP, WLCSP, and QFN.

Benefits

Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at .

Base Salary

USA, CA, San Diego - 185,200.00 - 250,000.00 USD annually

USA, CA, Sunnyvale - 213,000.00 - 287,500.00 USD annually

USA, TX, Austin - 185,200.00 - 250,000.00 USD annually

USA, WA, Redmond - 185,200.00 - 250,000.00 USD annually