Design Engineering Manager, Texas Institute for Electronics

Design Engineering Manager, Texas Institute for Electronics Hiring Department: Texas Institute for Electronics Position Open To: All Applicants Weekly Scheduled Hours: 40 FLSA Status: Exempt from FLSA Earliest Start Date: Immediately Position Duration: Expected to Continue Location: PICKLE RESEARCH CAMPUS The Texas Institute for Electronics (TIE) is a University of Texas at Austin-supported semiconductor consortium of state and local government, preeminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. Our mission is to develop and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth. Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing. With over $1 billion in funding from the US DoD and the state of Texas, we’re at the forefront of creating cutting-edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more. Benefits Competitive health benefits (employee premiums covered at 100%, family premiums at 50%) Voluntary Vision, Dental, Life, and Disability insurance options Generous paid vacation, sick time, and holidays Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b) Flexible spending account options for medical and childcare expenses Robust free training access through LinkedIn Learning plus professional conference opportunities Tuition assistance Expansive employee discount program including athletic tickets Free access to UT Austin's libraries and museums with staff ID card Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card Purpose The Design Engineering Manager will supervise a team of Design Engineers who will design and develop innovative semiconductor circuits and test structures to support TIE's facility manufacturing highly reliable and leading-edge 2.5D and 3D packaging solutions. This position will also manage and support multi-material (Silicon, III‑V, Glass) and multi-domain (Analog/Digital, RF, Power, Thermal, Mechanical Stress, Signal Integrity) design, modeling, and production activities. Responsibilities Supervise, guide, direct, and help train team of TIE Design Engineers through hands‑on collaboration. Assist with hiring, performance reviews, and upper management communication on product status and roadmap alignment Design and develop mixed signal circuits, test vehicles, test chips, and test structures for TIE's 3D‑ADK (Assembly Design Kit). Develop workflows, 2.5D/3D modeling methods, and standard cells for multi-chiplet, heterogeneous micro‑systems. Collaborate with Product and Test engineering teams to ensure performance, yield, reliability, and BIST methodologies. Work with EDA vendors to evaluate and improve tool offerings and capabilities. Develop and implement advanced models for semiconductor packaging effects. Improve automation of circuits and layouts using scripting languages. Participate in industry "design standards" workshops and consortiums. Collaborate with internal and external design teams on package compatibility. Design and execute experiments for packaging performance optimization. Conduct multi‑physics modeling and simulation studies. Stay current with industry trends and emerging technologies. Other related functions as assigned. Required Qualifications Bachelor's degree in Electrical Engineering, Semiconductor Physics, Materials Science, or a related field 10+ years of relevant industry experience in semiconductor IC design Previous supervisory experience with small to medium‑sized teams Strong understanding of semiconductor device physics and mixed signal circuit design Excellent problem‑solving skills and attention to detail Strong communication and teamwork skills Ability to manage multiple projects in a fast‑paced environment Proficiency in industry‑standard EDA software for circuit and/or package design Relevant education and experience may be substituted as appropriate. Preferred Qualifications Master's or higher degree in relevant semiconductor engineering fields Experience with 2.5D and 3D semiconductor packaging technologies Solid understanding of various packaging technologies (wire bonding, flip‑chip, wafer‑level packaging) Strong background in DFT/DFM methodologies and BIST techniques Experience in multi‑physics modeling (Power, Thermal, Mechanical, Signal Integrity, RF) Experience in a startup or R&D environment Salary Range TIE Pays Industry Competitive Salaries Working Conditions On‑site work in a scientific research environment and prototyping facility Dynamic work conditions with multiple partners/customers Occasional work outside standard office hours during peak periods Repetitive use of a keyboard at a workstation Use of manual dexterity (e.g., using a mouse) Climbing of stairs Required Materials Resume/CV 3 work references with their contact information; at least one reference should be from a supervisor Letter of interest Equal Opportunity Employer The University of Texas at Austin, as an equal opportunity/affirmative action employer, complies with all applicable federal and state laws regarding nondiscrimination and affirmative action. The University is committed to a policy of equal opportunity for all persons and does not discriminate on the basis of race, color, national origin, age, marital status, sex, sexual orientation, gender identity, gender expression, disability, religion, or veteran status in employment, educational programs and activities, and admissions. Pay Transparency The University of Texas at Austin will not discharge or in any other manner discriminate against employees or applicants because they have inquired about, discussed, or disclosed their own pay or the pay of another employee or applicant. However, employees who have access to the compensation information of other employees or applicants as a part of their essential job functions cannot disclose the pay of other employees or applicants to individuals who do not otherwise have access to compensation information, unless the disclosure is (a) in response to a formal complaint or charge, (b) in furtherance of an investigation, proceeding, hearing, or action, including an investigation conducted by the employer, or (c) consistent with the contractor's legal duty to furnish information. Employment Eligibility Verification If hired, you will be required to complete the federal Employment Eligibility Verification I-9 form. You will be required to present acceptable and original documents to prove your identity and authorization to work in the United States. Documents need to be presented no later than the third day of employment. Failure to do so will result in loss of employment at the university. #J-18808-Ljbffr Phase2 Technology