IC Packaging Materials Engineer for AI Chips
$160k - $312kTesla Motors, Inc.
Tesla Motors, Inc. is seeking a highly motivated IC Package Material Engineer to join their AI Hardware team in Palo Alto. This role involves developing and characterizing materials for Tesla's cutting-edge AI chip programs, ensuring high performance and reliability in diverse applications. The ideal candidate will have a Master’s degree and strong experience in IC packaging. The position offers a competitive salary between $160,000 - $312,000 annually, along with comprehensive benefits including medical plans, 401(k) with employer match, and various perks. #J-18808-Ljbffr Tesla Motors, Inc.
$160k - $312k
What to Expect The Tesla AI Hardware team is at the forefront... .... Comprising brilliant engineers and visionaries, the team designs... ...and develops advanced AI chips tailored to accelerate Tesla... ...looking for a highly motivated IC Package Material Engineer who will be part of...SuggestedHourly payTemporary workWork at officeFlexible hours$160k - $312k
...To Expect The Tesla AI Hardware team is at... ...brilliant engineers and visionaries, the... ...advanced AI inference chips tailored to accelerate... ...out study. Estimate package layer count and package... ...‑on experience on IC package substrate... ...Engineering, Materials Science, or related...SuggestedHourly payFull timeTemporary workFlexible hours$188k - $414k
Tesla in Palo Alto is seeking a highly motivated IC Package Thermal Engineer to work on innovative thermal solutions for AI chips. This role involves thermal simulation and characterizations, contributing to the designs for Tesla’s advanced AI systems. The ideal candidate...Suggested- ...Motors, Inc. in Palo Alto is seeking an IC Package Thermal Engineer within the AI Hardware team to deliver thermal solutions for Tesla's AI chip programs. You will perform thermal... ...component and system levels and drive material development. The role requires strong fundamentals...SuggestedFull time
$136k - $246k
...seeking a highly motivated IC Package Integration Engineer to lead IC package manufacturing... ...for next-generation AI compute platforms. This role... ...engineer will interface with material suppliers, substrate... ...technologies, including flip-chip BGA, high-density substrates...SuggestedHourly payTemporary workFlexible hours$108k - $240k
...development of suppliers, processes and packages for Auto Pilot SOC. The job involves communicating... ...to achieve mass production Lead material characterization and process corner... ...manufacturer, cross functional team of engineers, SCMs and QE with appropriate mitigation...Hourly payPermanent employmentContract workTemporary workFlexible hours$200k - $350k
DensityAI in Mountain View, California, is seeking a Packaging Engineer to own various aspects including Design Layout and... ...in packaging. You'll collaborate with chip-design and software teams for DensityAI's AI accelerator program. This role requires exceptional...$160k - $180k
...advanced supercomputers or AI systems will never... ..., transportation, materials, and other foundational... ...already produce billions of chips for telecom and... ...high‑precision optical packaging processes for photonic... ...’s Degree or above in Engineering, Physics or Material Science...Full timeWork experience placementShift work$188k - $414k
What to Expect The Tesla AI Hardware team is at the... .... Comprising brilliant engineers and visionaries, the... ...and develops advanced AI chips tailored to accelerate... ...for a highly motivated IC Package Thermal Engineer who will... ...as driving thermal material characterizations, data...Hourly payFull timeTemporary workFlexible hours$160k - $312k
Tesla is seeking an AI/ML Compute Architect in Palo Alto to drive the innovation of computing architectures for AI and machine learning applications. This role demands expertise in IC package substrate layout, hands-on experience with design tools, and a strategic mindset...- ...Motors, Inc. seeks a Senior/Staff Power Integrity Engineer to lead PDN design, simulation, and validation for AI chips and systems. You will ensure low impedance PDNs... ...and high efficiency, coordinating with SoC, package, and PCB teams to enable first-pass silicon success...
- Voltai in Palo Alto is seeking a Senior Verification Engineer to lead verification strategy and develop AI-assisted workflows for chip verification. This role offers the chance to influence the future of tooling and leverage deep verification expertise in a fast-moving...
$88k - $198k
...Candidates should have a relevant degree and experience with statistical process control and failure analysis techniques. A competitive salary ranges from $88,000 to $198,000 annually, along with a comprehensive benefits package available from day one. #J-18808-Ljbffr Tesla$200k - $350k
...Description Job Description About the role Own different aspects of Packaging including Design Layout, SI/PI and Thermo-mechanical aspects. Work with chip-design and software teams driving DensityAI's AI accelerator program from first silicon through scale-out. What...H1bVisa sponsorshipWork visa$180k - $202k
Lightmatter is leading the revolution in AI data center infrastructure, enabling the next... ...the world’s first 3D-stacked photonics engine, Passage™, capable of connecting thousands... ...inventing the future of computing with light! Chip Firmware Validation Engineer We are hiring...Full timeTemporary workFlexible hours$180k - $202k
Lightmatter is seeking a Chip Firmware Validation Engineer to develop and validate firmware for their innovative photonic AI processors. In this position, you'll work closely with various teams to ensure the integrity and reliability of the software stack. Required qualifications...$85k - $130k
PSI Quantum is seeking a highly motivated Optical Packaging Associate Engineer to support hands-on engineering validations and process development... ...building fiber-coupled optical packages with photonic chips and collaborating closely with various teams. Candidates should...- Intel in California is seeking an experienced IC Packaging Design Manager to lead a team in delivering advanced packaging solutions. The... ...in design methodologies, coupled with a strong capacity to mentor and manage engineering teams effectively. #J-18808-Ljbffr Intel
$128k - $312k
What to Expect The Tesla AI Hardware team is at the... ...innovation. Comprising brilliant engineers and visionaries, the... ...advanced AI inference chips tailored to accelerate... ...EM/IR analysis for 3D IC architectures including... ...the die stack including package and interposer contributions...Hourly payTemporary workWork experience placementFlexible hours$160k
...skilled Senior or Staff Power Integrity Engineer to lead the design, simulation, and... ...Networks (PDNs) for our next‑generation AI chips, packages and systems for Tesla's Robotaxi, Optimus... ...Oscilloscopes, or TDR Background in advanced IC packaging technologies (including 2.5D/...Hourly payTemporary workFlexible hours$135k - $212k
Lightmatter is seeking a Mechanical Engineer to work on innovative packaging technologies essential for AI architectures. This role involves designing advanced packages, conducting mechanical analyses, and collaborating with multiple teams to ensure optimized packaging...$160k - $414k
What to Expect The Tesla AI Hardware team is at the forefront of... .... Comprising brilliant engineers and visionaries, the team designs... ...develops advanced AI inference chips tailored to accelerate Tesla's... ...experience. The total compensation package for this position may also...Hourly payFull timeTemporary workFlexible hours$100k
...leading the industry on cutting‑edge AI technology, revolutionizing performance... .... Tenstorrent is seeking an Advanced Packaging Process Engineer with experience in 2.5D and 3D chiplet... ...Deep understanding of process flows and materials (polyimide, ABF, core, underfill, mold...Permanent employment- Description Senior Engineer, Signal Integrity and Power... ...and delivers System-on-Chip solutions to customers... ...preliminary activities of package selection, routing... ...understanding of a variety of IC package technologies.... ...of IC package materials and manufacturing Base...Work at officeRemote workWorldwideFlexible hours
$136k - $212.75k
...seeking a hard-working Senior Package Layout Engineer who is committed to making a... ...sophisticated, detailed layout of IC substrates for NVIDIA... ...layout of wire bond and flip chip packages, preferred. Significant... ...vacancy. NVIDIA uses AI tools in its recruiting processes...$124k - $195.5k
...outstanding opportunity as a Senior Package Modeling Engineer in the Advanced Technology... ...of computing, driven by AI and pioneering technology.... ...by evaluating new materials, interconnect concepts, and... ...and materials (flip‑chip, 2.5D/3D IC, CoWoS‑R, CoWoS‑L, advanced...$100k
Tenstorrent Inc. is looking for an Advanced Packaging Process Engineer to join their team in Santa Clara, CA. In this hybrid role, you will drive the... ...of advanced package technology for next-generation AI/ML products. The position requires a strong background in 2....$190k - $230k
Cerebras is seeking a Design Verification Engineer in Sunnyvale, CA, to develop and implement verification strategies for the world's largest AI chip. The role involves ensuring high-quality design through collaboration with architects, designers, and engineers, while enhancing...$100k
...leading the industry on cutting‑edge AI technology, revolutionizing performance... ...seeking a SoC Physical Design Verification Engineer to drive full‑chip signoff and ensure manufacturable,... ...collaborate across RTL, PD, CAD, and packaging teams to achieve successful tapeouts....Permanent employment$105k - $160k
...advanced supercomputers or AI systems will never... ...agriculture, transportation, materials, and other foundational... ...produce billions of chips for telecom and... ...Summary The Senior Process Engineer will support the development... .... Interface with packaging & assembly teams representing...Full timeShift work
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