Sr. Process Engineer (IC Packaging Transfer/Over Molding)

Company Overview

QP Technologies (formerly Quik-Pak), a division of Promex is a family-owned microelectronics assembly and product company based in Escondido, California. Founded in 1992, QP Technologies serves over 400 customers annually and is a trusted U.S. provider of on-shore, quick-turn semiconductor packaging services supporting new device and product development. Demand is growing concurrent with expansion of U.S. microelectronics, defense, and aerospace sectors and domestic reshoring prioritization.

Position Summary:

This hands‑on leader owns end‑to‑end process development, refinement and sustainment of our high mix/volume microelectronics packaging technology.Most critically, the successful applicant will leverage their core competencies in fundamental Engineering principles to design and scale a world‑class Molding operation, manage the team, and influence end‑to‑end microelectronics process solutions for customers in our Escondido, CA factory.

Essential Duties:

• Benchmark our existing Molding process and toolset by identifying root causes impacting product quality and yield at a first principles level through detailed problem solving and supporting data analysis
• Use design of experiments to identify and validate best consumables such as mold compound, cleaning agents, and epoxies
• Develop optimized recipes that cater to a range of products and form factors while creating a strong process with margin that caters for variations in product and materials
• Work with suppliers to simulate and design optimized overmold tooling
• Lead strategic selection and deployment of required capital equipment to scale process
• Adopt best known methods for process control that efficiently monitors process health over time, taking account of changeovers, preventive maintenance and event recovery
• Broaden your knowledge through hands‑on experience to extend to other microelectronics manufacturing processes
• Establish DFM rules to ensure designs and process windows are aligned for cost, quality and throughput

Minimum Qualifications:

• 7+ years of experience in Transfer- or Injection-molding Manufacturing Engineering in a volume environment
• Bachelor’s degree in Mechanical Engineering or equivalent
• Track record of solving complex problems
• Solid proficiency in SolidWorks for design work and revision control
• Solid proficiency in statistical process control

Key Competencies:

• Microelectronics/medical/aerospace domain knowledge not required — strong curiosity and willingness to learn these spaces matters more
• Hands‑on innovator who enjoys end‑to‑end product ownership involving complex systems
• Disciplined with excellent attention to detail and robust process control
• Strong written and oral communicator

Preferred Skills:

• Experience with overmolding using thermoset materials (microelectronics applications are a plus), micro-molding, or accommodating complex parts comprised of mixed materials
• Ability to interact with and influence key stakeholders and transfer required knowledge to manufacturing team members charged with day‑to‑day running of the process
• Willingness to use experience and knowledge to expand the role and impact beyond the core focus area
• Familiarity with working in ISO 9001 and ISO 13485 environments. Understanding of AS 9100, 21 CFR Part 820, and Good Documentation Practices (GDP).