Assembler III- SMT and Through Hole Soldering

The Assembler III – SMT & Through‑Hole PCB Specialist is a senior‑level production role responsible for assembling, soldering, inspecting, and reworking complex printed circuit board assemblies (PCBAs). The position requires advanced proficiency in Surface Mount Technology (SMT) and through‑hole assembly processes, along with the ability to interpret technical documentation and ensure high‑reliability workmanship standards. Key Responsibilities Perform advanced SMT and through‑hole component placement and soldering on complex PCB assemblies. Hand‑solder fine‑pitch, BGA (as required), and high‑density components. Perform rework and repair of SMT and through‑hole assemblies, including component removal and replacement. Interpret assembly drawings, bills of materials (BOMs), work instructions, and schematics. Inspect assemblies according to IPC standards (e.g., IPC‑A‑610) and ensure compliance with quality requirements. Maintain ESD compliance and proper handling of sensitive components. Accurately document production activity and quality records. Required Qualifications High school diploma or GED required; technical certification preferred. 5+ years of experience in SMT and through‑hole PCB assembly. Advanced hand‑soldering skills (fine‑pitch and micro‑components). IPC‑610A Certificate preferred. Must be IPC‑J‑STD‑001 Class3 certified. Knowledge of IPC‑A‑610 standards. Experience with PCB rework and repair techniques. Ability to read and interpret schematics and assembly documentation. Familiarity with ESD protocols and controlled manufacturing environments. Strong attention to detail and quality focus. Preferred Qualifications IPCJ‑STD‑001 certification. Experience in high‑reliability industries (aerospace and defense). Basic troubleshooting of SMT equipment. #J-18808-Ljbffr