Silicon Product and Failure Analysis Engineer, Google Cloud

Work on IC product qualification and plan and drive execution. Perform data analysis, characterization and fault isolation to figure out root cause of issues and define and direct design of experiments.Perform yield analysis and correlation analysis for all levels of tests. Perform statistical analysis during product ramp up.Define and finalize production screening guard-band specifications, appropriate test conditions based upon product design intent and characterization results.Work with cross-functional teams in driving suppliers to product qualification, initial yield ramp and manufacturing ramp.Work with cross-functional teams on failure analysis and debug of field issues and deliver engineering data and reports supporting Return Material Authorization (RMA) process.Minimum qualifications:Bachelor's degree in Mechanical/Computer/Electrical Engineering, Computer Science or equivalent practical experience.4 years of experience in product engineering, test engineering, or failure analysis for SoC or ASIC products.Experience with semiconductor manufacturing, wafer processing, chip packaging, or product reliability.Experience with manufacturing yield or RMA.Preferred qualifications:Master's degree in Mechanical/Computer/Electrical Engineering or Computer Science, focusing on semiconductors.Experience in ATE test and characterization, board level test and characterization and system level test and characterization.Experience in product bring-up, silicon debug and qualification, power/voltage/temperature, signal and power integrity characterizations, electrical failure analysis (EFA) and physical failure analysis (PFA).Knowledge of computer architecture, high performance IC design, high performance interface design, memory subsystem architecture, signal/power integrity analysis, timing analysis, fault analysis and electrical engineering fundamentals.Ability to work with internal cross-functional teams and external suppliers, demonstrating excellent leadership and presentation skills.In this role, you’ll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers Google's most demanding AI/ML applications. You’ll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.As a Silicon Product and Failure Analysis Engineer, you will contribute experience in product development to lead and drive high performance product readiness. In collaboration with functional teams, you'll analyze and resolve problems by identifying failure modes of affected materials as part of a fast-paced environment.The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide. We're the driving team behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.Individual pay is determined by factors including job-related skills, experience, and relevant education or training. US: $138000 - $198000 (USD) + 15% bonus target + equity + benefitsLearn more about benefits at Google.Bachelor's degree in Mechanical/Computer/Electrical Engineering, Computer Science or equivalent practical experience.4 years of experience in product engineering, test engineering, or failure analysis for SoC or ASIC products.Experience with semiconductor manufacturing, wafer processing, chip packaging, or product reliability.Experience with manufacturing yield or RMA.