Silicon Product Engineer

Apply Qualifications Bachelor’s degree in Electronic Material Science, Polymer Engineering, Electrical Engineering, Computer‑Aided Design, Semiconductor Physics, Manufacturing Statistical Process Control or a related field, and 10+ years progressive post‑baccalaureate experience in this area or in a Silicon Product Engineering‑related occupation. Alternatively, a Master’s degree in the same field with 8+ years experience in the same area. 8 years of experience in the following technical areas: Advanced Packaging Process Development & HVM Qualification such as for Mobile SOC or SiP (System in Package) IC Packaging Failure Mode and Effects Analysis (FMEA), Design of Experiment techniques (DOE) and Statistical Process Control (SPC) Chip‑Package Interaction (CPI) evaluation, Electromigration (EM) Analysis, package component & board‑level reliability testing Failure Analysis and Root Cause Corrective Action for IC Packaging Technical engagement and program execution with packaging ecosystem partners including OSATs, substrate manufacturers, and material/machine suppliers. Responsibilities Define, develop, and optimize high‑volume manufacturing (HVM) processes for advanced semiconductor packaging technologies for consumer devices, ensuring compliance with electrical, thermal, mechanical, environmental, and cost requirements, especially mobile SOC SIP for on‑device AI. Drive process optimization and yield improvement using Design of Experiments (DOE) methodology and establish rigorous process monitoring and control systems to ensure robust manufacturing. Establish and evaluate the effects of package assembly and bumping processes, specifically assessing Chip Package Interaction (CPI) effects such as Silicon ELK stress and impact on board‑level reliability. Lead Electromigration (EM) evaluations for fine‑pitch package solutions, defining material and process requirements to meet long‑term package development and reliability roadmaps. Perform comprehensive failure analysis and root cause resolution for manufacturing and field issues encountered during both the technology development and mass production phases. Collaborate and manage key suppliers, including OSATs, substrate vendors, and packaging ecosystem partners, to drive technology roadmap execution and establish internal packaging. Domestic and International travel required. The US base salary range for this full‑time position is $176,150 - $237,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Google is proud to be an equal opportunity and affirmative action employer. We are committed to building a workforce that is representative of the users we serve, creating a culture of belonging, and providing an equal employment opportunity regardless of race, creed, color, religion, gender, sexual orientation, gender identity/expression, national origin, disability, age, genetic information, veteran status, marital status, pregnancy or related condition (including breastfeeding), expecting or parents‑to‑be, criminal histories consistent with legal requirements, or any other basis protected by law. See also Google's EEO Policy , Know your rights: workplace discrimination is illegal , Belonging at Google , and How we hire . Google is a global company and, in order to facilitate efficient collaboration and communication globally, English proficiency is a requirement for all roles unless stated otherwise in the job posting. To all recruitment agencies: Google does not accept agency resumes. Please do not forward resumes to our jobs alias, Google employees, or any other organization location. Google is not responsible for any fees related to unsolicited resumes. #J-18808-Ljbffr Google Inc.