N2 Photo Equipment Technician

Responsibilities Perform scheduled and unscheduled maintenance in the ATMC Photolithography Equipment area. Maintain, repair, upgrade, and monitor wafer fabrication equipment, including troubleshooting and repair for ASML TWINSCAN, ASML 5500, TELACT8, LITHIUS, and LITHIUS PROZ. Perform maintenance on electrical/electronic, pneumatic, and mechanical systems, scheduled maintenance, consumable changes, and various other activities relevant to area success. Complete documentation and train others on equipment maintenance. Effectively communicate using written and verbal skills. Stand for long periods (up to 12 hours), occasionally stoop or crawl in confined spaces. Lift and carry objects up to 50 pounds. Qualifications Preferred: AS or AAS in electronics, industrial engineering, or related. Equivalent experience may satisfy the requirement. Minimum 8 years of experience in the semiconductor industry, or an equivalent combination of education and experience. Minimum 5 years of technical maintenance experience in the Photolithography area. Strong verbal and written communication skills. Excellent problem‑solving skills. Solid understanding of SPC and FDC, and ability to use these controls to improve overall equipment performance. Ability to interact and communicate with all Operations and Engineering personnel. Capability to interface with other internal and external groups to ensure safety, performance, and reliability requirements are satisfied. EEO Statement NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals. #J-18808-Ljbffr NXP Semiconductors N.V.