TD Media and Collaterals Development Engineer

Job Description This role requires regular onsite presence to fulfill essential job responsibilities. Additive manufacturing: Develops media and collaterals for assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of media and collaterals, developing improvements to meet quality, reliability, cost, yield, productivity, and manufacturability requirements. Develops media and collateral specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. Equipment and validation: Develops and maintains equipment to evaluate media and collateral solutions under simulated field use conditions, such as heat, humidity, vibration, temperature cycle, and dynamic forces. Creates new techniques and acceleration methods, tools, and quality screens to ensure early identification of potential problems with media and collateral quality and reliability. Design and consultation: Performs and influences media and collateral design, material selection, and prototype development to meet assembly module needs based on a fundamental understanding of failure mechanisms. Provides consultation concerning design problems and improvements in the assembly packaging process and responds to customer/client requests or events as they occur. Delivers standardization in media and collateral qualification, manufacturing prototypes, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for key risk areas in meeting product milestones. Qualifications Minimum Qualifications Possess a BS/MS/PhD degree in Mechanical Engineering, Material Engineering, Electrical Engineering, Physics, or a related field. Minimum 6 months of experience in fundamental science and engineering concepts in development to create novel solutions, with strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Preferred Qualifications Strong mechanical design software experience (SolidWorks, AutoCAD, etc.). Portfolio of self‑completed project examples from concept to fabrication. Assembly equipment, process, media, and/or collateral experience. Technical innovation and delivery of complex, time‑critical technical projects. Understanding of semiconductor fabrication processes and technology with technical and analytical skills. Requirements listed will be obtained through a combination of industry‑relevant job experience, internship experiences, and/or schoolwork/classes/research. Job Information Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Annual salary range for jobs which could be performed in the US: $115,110.00-162,500.00 USD. #J-18808-Ljbffr Intel Corporation