Advanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift)
$99.03k - $139.81kIntel
Job Details Job Description: The Module Engineer On Shift (MEOS) provides real‑time factory support by addressing equipment, process, and product issues to ensure continuous 24/7 manufacturing operations. This role is responsible for supporting lot movement through the manufacturing line, responding to process excursions, recovering from equipment errors, dispositioning lots, enabling new tools, and performing other operational activities required to support factory objectives. This is a night shift, onsite position located in Chandler, Arizona. Key Responsibilities Receive and review written and verbal shift pass-downs from outgoing shift personnel and align on priorities with management. Provide real-time support for equipment, process, and product issues within the manufacturing environment. Execute non-standard procedures and perform inspections and imaging on substrate panels to collect development and process data. Write and update specifications, procedures, and Requests for Change (RFCs) as required. Communicate key issues and updates with tool owners, process owners, and cross-functional partners. Document and communicate all shift activities through detailed written and verbal pass-downs to the incoming shift team. Support new tool enablement, lot disposition activities, and process troubleshooting efforts. Maintain compliance with safety, quality, and operational standards. Nightshift Shift 4: (nights frontend) PM‑AM Sun‑Tues and alternating Saturday nights. This position is not eligible for immigration sponsorship. Behavioral Skills The ideal candidate should demonstrate: Strong problem‑solving and troubleshooting capabilities. Effective verbal and written communication skills. Ability to adapt to changing priorities in a fast‑paced manufacturing environment. Ability to work independently with minimal supervision. Self‑motivation and ownership of assigned responsibilities. Ability to collaborate effectively within a cross‑functional team environment. Qualifications Minimum Qualifications: Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline, with 1+ years of relevant experience. OR Master's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline with 0 years of relevant experience. Proficiency in statistical data analysis, process characterization, and quality systems for manufacturing. Preferred Qualifications Experience with design of experiments (DOE) principles and statistical process control (SPC). Knowledge of manufacturing process control and reliability testing. Experience in semiconductor manufacturing or packaging substrate development. Familiarity with metrology tool recipe creation and troubleshooting. Strong problem‑solving abilities and the capability to collaborate effectively across teams. Job Type Experienced Hire Shift Shift 4 (United States of America) Primary Location US, Arizona, Phoenix Business Group Intel Foundry strives to make every facet of semiconductor manufacturing state‑of‑the‑art while delighting our customers — from delivering cutting‑edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembles/test packages the compute devices to improve the lives of every person on Earth. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust: N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Annual Salary Range for jobs which could be performed in the US: $99,030.00 - 139,810.00 USD. Work Model for this Role This role will require an on‑site presence. Job posting details such as work model, location or time type are subject to change. Intel is committed to Responsible Business Alliance compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. #J-18808-Ljbffr Intel
- Intel is seeking a Module Engineer On Shift in Chandler, Arizona. This role involves providing real-time factory support and ensuring optimal manufacturing operations during the night shift. Responsibilities include addressing equipment issues and maintaining safety compliance...Night shiftShift work
$133.8k - $255.2k
...shaping the future of technology to help create a... ...Life at Intel: The Advanced Packaging Substrate Integration Team is... ...committed capacity. Development and maintenance of... ...teams, and process module engineering teams to achieve new... ...Experienced Hire Shift: Shift 1 (United States...SuggestedLocal areaImmediate startShift work- Intel Corporation is seeking a Module Engineer On Shift in Phoenix, Arizona. This role provides real-time support in semiconductor manufacturing and requires a Bachelor's degree in a relevant field with at least one year of experience. Candidates must possess strong problem...Night shiftShift work
$99.03k - $139.81k
Job Overview Become part of Intel's Advanced Packaging Technology Development Substrate and Wafer Assembly (APTD SWA) organization. Our mission is to... ...and rewarding work environment. The Module Engineer On Shift (MEOS) is responsible for providing factory support...SuggestedLocal areaShift workDay shift- Intel Corporation is seeking a Packaging Module Development Engineer in Phoenix, Arizona. You will innovate semiconductor packaging technologies that drive advancements in computing. Key responsibilities include developing packaging solutions and optimizing processes in...SuggestedFull time
- Intel Corporation is seeking a Packaging Module Development Engineer in Phoenix, Arizona. This role involves developing innovative packaging solutions for semiconductor technologies and entails strong technical leadership skills and the ability to collaborate across teams...
$115.11k - $219.55k
...The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading... .... The Packaging Module Development Engineer will contribute to advancing... ...Type: College Grad Shift: Shift 1 (United States...Local areaShift work$120.86k - $231.67k
## Ocotillo Technology Fabrication Experienced Module EngineerApplylocations... ...(OTF) Module Engineer role is... ...throughout the development cycle.* Drives... ...a day or night shift as an OSE (on-shift... ...silicon process and packaging technology... ...improvements to advanced packaging all the...Night shiftInternshipStart working todayLocal areaShift workDay shift$176k - $242k
...in materials engineering solutions used... ...new chip and advanced display in the... ...the exciting technologies that literally... ...skilled Advanced Packaging Technologist to... ...and process development while ensuring... ...large form factor substrates. This role... ...films, etc.), module co‑optimization...Full timeRelocation- ...Overview Intel’s Ocotillo Technology Fabrication (OTF) Module Engineer will play a central role... ...throughout the development cycle. Drive improvements... ...production lines. Optional on‑shift engineering (OSE) support... ...field. Experience in an advanced‑node semiconductor...Night shiftLocal areaShift workDay shift
$99.03k - $162.5k
Become a part of Intel's Advanced Packaging Technology Development Substrates (APTD Substrates) organization. Our mission... ...effectively interact with peers, engineers, and customers. Flexibility and... ...Information Job Type: Experienced Hire Shift: Shift1 (United States of America...Local areaShift work$99.03k - $188.89k
## Packaging Module EngineerApplylocations: US, Arizona... ...Packaging Module Engineer**, you will play... ...shaping Intel's advanced packaging... ...deliver world-class technology solutions. This role... ...* Lead packaging development processes, including... ...Hire## Shift:Shift 1 (United States...Work experience placementLocal areaImmediate startShift work- Intel Corporation is seeking a Mechanical Tooling Engineer in Phoenix, Arizona to drive technology development for advanced semiconductor packaging. You will design and develop manufacturing processes and collaborate with suppliers to enhance efficiency and production output...
$85.2k - $139.81k
Intel Corporation is seeking a Yield Engineer On Shift in Phoenix, Arizona, to support the Advanced Packaging Team. This position involves real-time troubleshooting... ...Join us in a collaborative environment focused on advanced technology! #J-18808-Ljbffr Intel CorporationNight shiftShift work$85.2k - $139.81k
Role Overview Join Intel's Advanced Packaging Team as part of the Substrate Packaging Technology Development (SPTD) organization. The Yield Engineer On Shift (YEOS) provides critical factory support by addressing equipment, process, and product issues in real time to enable...Night shiftLocal areaShift workWeekend work- Job Summary Ocotillo Technology Fabrication (OTF) Module Engineer - a central requisition for all OTF functional... ...characterize the process throughout the development cycle. Drive improvements in... ...Support toolset needs on day or night shift as an OSE (on‑shift engineer) when...Night shiftShift workDay shift
- A leading technology firm is seeking a Silicon Packaging Design Engineer in Phoenix, Arizona. This role involves end-to-end development of substrate designs, collaboration with silicon and hardware teams, and ensuring optimal cost efficiency and manufacturability. Ideal...
$60.45k - $85.34k
...Become a part of Intel's Advance Packaging Team by joining the Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTDSWA... .... • Work closely with Module Engineering to execute experiments,... ...assignments effectively. Shift Hours: Employees working...Hourly payInternshipLocal areaImmediate startShift work3 days per week- ..., where cutting edge technology meets collaborative culture... ..., our people and our advanced semiconductor devices... ...on the world. Our development programs help support... ...As a senior process engineering leader at ASM, you... ...computing (HPC) and advanced packaging. You’ll lead a team...
$51.71k - $99.77k
...Become a part of Intel's Advance Packaging Team by joining the Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTDSWA... ...process, and training.**Shift Hours:*** **Employees... ...reliability.* Work closely with Module Engineering to execute experiments,...Night shiftHourly payInternshipLocal areaShift work3 days per week- Applied Materials is seeking an Advanced Packaging Technologist to join their Disruptive Technology Pathfinding team in Phoenix, AZ. This role involves leading innovative packaging integration processes and developing advanced technology while collaborating with multiple...
- SiC Wafer and Package Technology Development Engineer Scottsdale, AZ, United States and 1 more Job Description Technical and customer support for the qualification of SiC die sales and development SiC wafer die sales is a main focus for onsemi and is critical to its future...Local area
- onsemi in Scottsdale, AZ, is seeking a SiC Wafer and Package Technology Development Engineer responsible for technical and customer support in SiC die sales qualifications. This role involves solving complex challenges while leading global teams to develop future technology...
$120.86k - $231.67k
Job Overview The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible... ...collaborating closely with cross functional engineering teams and supplier partners.... ...Job Type: Experienced Hire Shift: Shift 1 (United States of...Local areaShift workAfternoon shift$76.39k - $146.44k
## Ocotillo Technology Fabrication Sh6 Production... ...Description:A Line Engineer will be expected to manage shift loop operations to... ...partnership with the loop modules and Manufacturing.... ...process and packaging technology leadership... ...yield improvements to advanced packaging all the...Night shiftLocal areaShift work- ...As an Advanced Test Engineer here at Honeywell, you will lead the design, development, and execution of complex test plans and procedures... ...discipline such as science, technology, engineering, mathematics... ...for a comprehensive benefits package. This package includes employer...Permanent employmentTemporary workFlexible hours
- ...Location 4239 N 39th Avenue, Phoenix, Arizona 85019 Work Shift: 8hr-3rd Shift (United States of America) Job Overview The Production Packaging Associate is an entry level position, responsible for proper packaging of materials and finished products. This position will...Night shiftSeasonal workLocal areaImmediate startShift work
$220.32k - $311.04k
...Welcome!**.Foundry Services Advanced Packaging Account Technical Solutions Engineer page is loaded##... ...process and packaging technology leadership for the AI era... ...teams including Technology Development, Product Engineering,... ...:Experienced Hire## Shift:Shift 1 (United States...Local areaImmediate startShift work$50 - $60 per hour
Sr Advanced Project Engineer | Phoenix, AZ Our client, a leading aerospace and defense technology organization, is seeking a Project Manager to join... ...the design, analysis, and development of aerospace propulsion... ...engine design, turbofan/fan module design, aircraft integration...Weekly payFull timeTemporary workLocal areaRelocationFlexible hours- ...innovation and diversity As an Advanced Systems Engineer here at Honeywell, you... ...in shaping the future of technology and industry solutions. You... ...role, you will impact the development and implementation of... ...a comprehensive benefits package. This package includes employer...Permanent employmentTemporary workFlexible hours
Do you want to receive more vacancies?
Subscribe and receive similar vacancies to Advanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift). Be the first to apply!
- research and development engineer Phoenix, AZ
- r&d engineer Phoenix, AZ
- engineering development program Phoenix, AZ
- development engineer Phoenix, AZ
- supplier development engineer Phoenix, AZ
- method development scientist Phoenix, AZ
- process development scientist Phoenix, AZ
- product development scientist Phoenix, AZ
- engineering leadership development program Phoenix, AZ
- r&d engineering technician Phoenix, AZ

