APTD SWA Module Engineer On-Shift (Dayshift)

Job Overview Become part of Intel's Advanced Packaging Technology Development Substrate and Wafer Assembly (APTD SWA) organization. Our mission is to be the supplier of choice for leading‑edge, cost‑effective substrate packaging solutions. Join the APTD SWA team and help advance this mission while contributing to a collaborative and rewarding work environment. The Module Engineer On Shift (MEOS) is responsible for providing factory support by addressing equipment, process, and product issues in real time to enable continuous 24×7 lot movement through the manufacturing line. This role responds to process issues, performs error recovery, manages lot disposition, supports new tool enablement, and carries out various ad hoc responsibilities within the assigned functional area as required by factory operations. Key Responsibilities Receive written and verbal shift pass‑downs from the outgoing shift and align priorities with management. Spend the majority of the shift on the factory floor supporting equipment and process‑related issues, while writing and updating specifications and RFCs as needed. Execute non‑standard procedures and perform panel inspections and imaging to collect development data. Communicate key issues with tool and lot owners via email. Provide comprehensive written and verbal shift pass‑downs to the incoming shift, ensuring continuity of operations. Behavioral Traits Strong problem‑solving and troubleshooting skills. Effective verbal and written communication skills, with the ability to collaborate successfully with peers, engineers, and customers. Flexibility and the ability to efficiently adapt to new tasks and responsibilities. Ability to work with minimal supervision while adjusting to rapidly changing priorities. Self‑motivated with the ability to manage individual responsibilities while contributing to overall team objectives. Qualifications Minimum Qualifications Bachelor’s degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline, with 6+ months of relevant experience. Master’s degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline, with 0 years of relevant experience. Proficiency in statistical data analysis, process characterization, and manufacturing quality systems. Preferred Qualifications Experience applying Design of Experiments (DOE) methodologies and Statistical Process Control (SPC). Knowledge of manufacturing process control and reliability testing. Experience in semiconductor manufacturing or packaging substrate development. Familiarity with metrology tool recipe development and troubleshooting. Demonstrated problem‑solving skills and the ability to collaborate effectively across cross‑functional teams. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Annual salary range for jobs which could be performed in the US: $99,030.00 - $139,810.00 USD. Additional Information Job Type: College Grad Shift: Shift 5 (United States of America). Primary location: Phoenix, Arizona, USA. The role requires an on‑site presence. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. #J-18808-Ljbffr Intel Corporation