DMTS Digital Design Engineer / Chip Lead

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's Interface Pathfinding team operates at the leading edge of that mission — driving performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. As the Digital Design Engineer / Chip Lead, you will be the technical anchor of a small, senior team spanning analog design, layout, silicon characterization, physical design, and verification — united around the goal of carrying high-speed interface innovations from architecture to tape‑out. This is a full‑ownership role. You will define top‑level chip architecture, author and maintain synthesizable RTL for all soft IP control blocks, own timing constraints and clock domain crossing strategy, drive synthesis and tape‑out sign‑off, and produce the design documentation that serves as the authoritative reference for the team. The program integrates a fully custom analog PHY alongside digital control functions — providing a technically rich chip‑lead scope that spans hard macro integration, third‑party IP management, and original RTL design. This is a foundational hire for a growing program. Strong execution early is expected to lead to follow‑on projects of increasing scope, team size, and design complexity. Responsibilities Chip Architecture & Integration: Define top‑level chip architecture, partition responsibilities across hard and soft IP blocks, and own the integration of hard macros alongside third‑party soft IP. RTL Design: Author, review, and maintain synthesizable RTL (SystemVerilog) for all soft IP control blocks, CSR/register file, clocking control logic, and top‑level integration. Timing Closure Leadership: Develop and own chip‑level timing constraints (SDC), define clock domain crossing strategy, and provide timing budgets per block to the Physical Design engineer. Synthesis: Drive logic synthesis (DC / Genus) and guide optimization for PPA targets across all design blocks. IP Management: Define interfaces between PHY hard macro, third‑party soft IP, and internally designed blocks; manage IP integration agreements and vendor coordination. Tape‑Out Ownership: Own and drive the tape‑out checklist sign‑off process, coordinating across Physical Design, Verification, and analog team members to achieve clean handoff to the foundry. Design Documentation: Author architecture specifications, block‑level design specifications, and interface control documents that serve as the authoritative reference for the team. Follow‑On Roadmap: Capture design decisions, lessons learned, and architectural rationale to accelerate follow‑on chip development. Basic Qualifications BS, MS, or PhD in Electrical Engineering, Computer Engineering, or related field. 10+ years of ASIC/digital design experience with at least one prior tape‑out in a chip lead, design lead, or senior designer role. Expert‑level proficiency in SystemVerilog RTL design and coding best practices. Strong experience with logic synthesis tools (Synopsys Design Compiler or Cadence Genus) and static timing analysis (PrimeTime or Tempus). Proficiency with industry‑standard RTL simulation and debug tools (VCS, Xcelium, or equivalent; Verdi or DVE for waveform debug). Solid understanding of CDC analysis methodologies and tools (SpyGlass, JasperGold CDC, or equivalent). Demonstrated experience integrating hard and soft IP blocks in a mixed‑signal or PHY‑adjacent chip environment. Ability to work effectively as a technical lead on a small team — comfortable making decisions with incomplete information and owning the outcomes. Strong written communication skills — this role produces specifications, not just code. Preferred Qualifications Experience with high‑speed PHY architectures (SerDes, DDR, or equivalent analog I/O structures). Familiarity with I2C management bus architecture, Eye Monitor control logic, or PRBS‑based error counting implementations. Experience with DFT strategy definition including scan insertion, ATPG planning, and boundary scan for high‑speed I/O. Familiarity with OTP/fuse‑based trim and calibration architectures for PHY analog parameters. Prior experience in a small team or startup‑like environment where role boundaries are defined by need rather than org chart. Compensation The US base salary range that Micron Technology estimates it could pay for this full‑time position is $206,000.00 - $410,000.00 a year . Additional compensation may include benefits, bonuses, and equity. Benefits Micron offers a choice of medical, dental, and vision plans in all locations, enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits. EEO Statement Micron is proud to be an equal‑opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr Micron Technology