Product Development Engineer (28nm)

Join the Revolution in Semiconductor Manufacturing at LFAB!We're at the forefront of an exciting era of growth and innovation at LFAB (Lehi Fab), where our state-of-the-art 300mm, 65nm, 45nm and 28nm analog and embedded wafer manufacturing facilities are driving production of a diverse semiconductor portfolio in the heart of the Silicon Slopes. As we continue to expand we're seeking an experienced Product Development Engineer with expertise in 28nm or equivalent advanced node technologies to drive our new technology ramp. At full production, our wafer fabs will manufacture tens of millions of analog and embedded processing chips every day and power electronics everywhere, supporting customer demand for decades to come. We're committed to responsible, sustainable manufacturing and making a meaningful impact on the local community through job creation and substantial investments in K-12 STEM education. In this role, you will be part of the factory team that will lead the activities ramp of our latest 28nm technology to yield entitlement, helping shape the future of the semiconductor industry.Responsibilities include:Yield Optimization: Conduct thorough analysis of production yield issues to identify root causes and implement corrective actions that enhance product performance and manufacturing efficiency.New Product Launch: Collaborate with Business Units to characterize, qualify, and successfully release new products to production, ensuring a smooth transition from design to manufacturing.Production Support: Address daily production challenges including low yield disposition and process troubleshooting.Continuous Improvement: Lead initiatives focused on productivity, cost reduction, and quality enhancement across the production process.Data-Driven Insights: Utilize statistical tools and production data to guide engineering decisions and process improvements.Design Collaboration: Work with design teams on product simulation, design verification and silicon debug. Cross-functional Collaboration: Liaise with business units' product engineering teams to drive yield improvements through test program optimization, hardware enhancements, and setup adjustments.Why TI?Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TIBenefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits hereAbout Texas Instruments Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com. Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws. If you are interested in this position, please apply to this requisition. TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.Minimum requirements:Experience with 28nm (or similar) technologiesBachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field5+ years of experience in semiconductor manufacturing, test engineering, failure analysis, or related areasStrong technical background in semiconductor devices, testing, or failure analysis principlesExperience analyzing production test data and diagnostic results to investigate device failuresProficiency in tools such as JMP, Excel, and statistical analysis software.Excellent communication and collaboration skills.Ability to work independently and in cross-functional teams.Preferred qualifications:Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or related field10+ years of experience in semiconductor manufacturing, testing, failure analysis, or yield engineeringExperience with memory mapping tools, ATPG diagnostics with Cadence Modus or Synopsys Tetramax , and Avalon layout database environmentsExperience using electrical failure analysis techniques such as photon emission analysis, laser-assisted fault isolation, waveform acquisition, or similar FA instrumentationExperience analyzing wafer-level yield or semiconductor process development issuesExperience with digital IC design, mixed-signal IC design, or related design environmentsExpertise in analog/mixed-signal circuit design, analysis, and verification, including experience with Operational Amplifiers (OP Amps), Analog-to-Digital Converters (ADCs), Digital-to-Analog Converters (DACs), and Radio Frequency (RF) circuitsExperience with digital logic design and verification, including Automatic Test Pattern Generation (ATPG) and scan chain design and implementationKnowledge of memory design and architecture, including Static Random-Access Memory (SRAM) and Flash memoryIn-depth knowledge of semiconductor manufacturing processes, including fabrication, assembly, and testProven ability to drive results, prioritize tasks, and manage time to meet project deadlinesAdaptability and resilience in a fast-paced, dynamic environment with multiple priorities and interruptionsStrong interpersonal and influencing skills, with ability to build effective relationships and communicate with diverse stakeholdersExceptional problem-solving skills, with attention to detail and ability to think creativelyStrategic thinking and ability to navigate complex, high-pressure situations with poise and professionalismFull timePosting Date: 2026-03-19