Product Manager, Packaging Assembly Business Unit

Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer‑level processing, and system‑in‑package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. Position Summary Amkor is looking to fill a Product Management position for the Advanced Flip Chip Packaging Assembly Business Unit in Tempe, AZ. This position includes cross‑functional management and direct customer interactions for new product development, qualification and mass production of advanced flip chip products. The role combines deep technical knowledge, project management, strategic planning, tactical execution, customer satisfaction control, business sense, and negotiation skill. The chosen individual will need to help define and concurrently manage ownership of multiple programs, from both the business and technical sides. Essential Duties And Responsibilities Duties include the daily application of detailed knowledge of semiconductor packaging assembly and substrate technologies across many concurrent development / NPI programs. Drive customer requirements and timelines to multiple southeast Asia factories. Deep dive into root‑cause failure analysis and clear obstacles with product design, reliability, and manufacturability issues. Perform and analyze detailed cost modeling for product‑level assembly pricing. The candidate will be responsible for driving cost reductions and increased revenues within the assigned customer base. Work across different functional groups and involve engineering, product development and associated product lines. Develop strong working relationships with all equipment, material, and substrate suppliers. Work closely with suppliers and factory engineers to identify capabilities and capacities for all key processes and material sets used in our fcCSP product roadmap (ABF, uBall, stacked vias, Coreless, TIM/adhesives, etc.). Align on Technology Roadmaps and drive flip chip priorities for use in consumer, compute, mobile APs, and automotive products. Identify gaps for R&D priorities such as transition from iPOP to other alternatives in the mobile space. Participate in pricing and capacity expansion negotiations both internally and externally. Travel to customer and factories as needed. Required Qualifications Bachelor’s Degree in a related Engineering field (Mechanical, Chemical, Materials, Electrical engineering) and 10+ years of experience in the semiconductor industry; or a Master’s Degree in Engineering with a minimum of 8 years of relevant industry experience. Extremely organized technical Project Management experience (preferably involving off‑shore factories) and the ability to multitask across numerous programs and teams. Demonstrated ability to work independently in a heavily matrixed organization. Requires self‑driven and highly motivated to adapt and overcome obstacles across a multi‑faceted role, assuming ownership of program success. Proactive identification of potential risks before production starts to enable backup plans or alternate assembly strategies. Deep knowledge of semiconductor packaging design, materials, substrates, manufacturing methods and various flip chip package form factors. Excellent written and verbal communication skills. Frequent face‑to‑face and teleconference technical presentations to customers required. Proficiency with Microsoft Office (Excel, PowerPoint, Outlook) mandatory. Approximately 15% domestic and 15% international travel. Preferred Qualifications Hands‑on manufacturing/technical experience or exposure to the manufacturing floor. PMP certification. Experience with cost modeling, pricing, quoting activities and products. Knowledge of material and package characterization data analysis, reliability test methods and qualification procedures. Experience/knowledge of flip chip packaging failure analysis methods. Familiarity with Design of Experiments and Statistical Process Control (JMP). Previous experience in an external customer‑facing role. Experience with public speaking (e.g., technical conferences). Experience with multiple advanced packaging technologies such as fcCSP, iPOP, HDFO, RDL, and 2.5D or other advanced packaging options. Location Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered. Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance. #J-18808-Ljbffr Amkor Technology, Inc.