Lead Advanced Packaging Engineer - Optical Chips & 2.5D/3D
Astera Labs
Astera Labs in San Jose, CA seeks a Principal Advanced Packaging Engineer to lead R&D for next-generation packaging technologies for optical chips. This senior individual contributor role sets technical direction and drives packaging development for NPO and CPO products. You will define packaging flows (2.1D/2.5D/3D), qualify materials, collaborate with OSATs and suppliers, and improve yield and reliability across wafer-, panel-, and die-level processes. #J-18808-Ljbffr
Vacancy posted 3 days ago
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