Senior Signal Integrity Engineer

Senior Signal Integrity Engineer

The Team:

General Motors is at the forefront of the transformation of automotive with the electrification of our portfolio and the development of leading-edge central compute and autonomous capabilities. Our ECU Electrical team is a dynamic, high-energy, and innovative group focused on developing electrical design of next generation ECUs (Electronic Control Units). The team also reviews and approves production ECU design changes.

We are seeking a Senior Signal Integrity Engineer to ensure the performance and reliability of high-speed hardware designs by analyzing and mitigating signal degradation issues. This role will collaborate with cross-functional teams to optimize design processes and address potential signal integrity challenges early in development. The ideal candidate will play a critical part in supporting our semiconductor strategy, driving innovation, and ensuring product excellence in next-generation systems.

The Role:

In-vehicle electronics is a fast-growing technology in the global automotive industry featuring many cutting-edge technologies such as Compute, body and zone controllers, multi-view cameras, Gig+Ethernet, PCIe, digital/analog interfaces and more. We are looking for creative and enthusiastic candidate to become part of a fast-moving team who want to lead the future direction of the automotive industry.

The ECU hardware design team's mission is to ensure our products are designed to target the growing needs of our customers while ensuring robust, well-designed hardware which meets GM specifications and testing requirements from early hardware through the production design. In this role you will be responsible for leading product development and integration activities.

Responsibilities include utilizing engineering tools and processes to successfully develop components and systems for vehicle programs.

What You'll Do (Responsibilities):

• Perform detailed signal integrity (SI) simulations using tools such as HyperLynx, HFSS, or CST to identify and resolve issues related to crosstalk, signal loss, reflections, and other performance degradations in high-speed designs.
• Analyze PCB layout designs to ensure optimal signal performance, providing feedback and recommendations to layout and hardware design teams.
• Collaborate with hardware engineers to optimize high-speed signal paths, ensuring adherence to specifications for interfaces like DDR, PCIe, USB, SerDes, and Ethernet.
• Evaluate and validate signal integrity for power delivery networks (PDN) to minimize noise, ground bounce, and power/ground integrity issues.
• Work closely with PCB layout, hardware, and mechanical teams to ensure design choices align with signal integrity best practices.
• Partner with systems engineering and software teams to ensure signal integrity across the entire product stack, from silicon to system integration.
• Develop and implement test strategies for verifying signal integrity on prototypes and final products using tools like oscilloscopes, vector network analyzers (VNA), and time domain reflectometry (TDR).
• Create and maintain signal integrity design guidelines, best practices, and checklists to support hardware engineers throughout the product development lifecycle.
• Lead the evaluation of new materials, design techniques, and tools that enhance signal integrity, proposing innovations that improve overall system performance.
• Diagnose and resolve SI issues during the bring-up phase of new products, ensuring minimal impact on time-to-market.

What You'll Need (Required Qualifications):

• Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, or a related field.
• 5+ years of experience in signal integrity, high-speed PCB design, or related areas in hardware engineering. High speed Communication Buses (Ethernet, PCIe, SerDes…)
• Strong understanding of high-speed signal transmission principles, including impedance, crosstalk, noise, and signal attenuation.
• Proficiency in SI analysis tools such as HyperLynx, HFSS, CST, ADS, or similar industry-standard software.
• Hands-on experience with lab equipment such as oscilloscopes, VNAs, TDRs, and protocol analyzers.
• Expertise in PCB layout and design rules for high-speed, multi-layer boards.
• Familiarity with current SI trends, emerging technologies, and innovations in high-speed data transmission.
• Ability to contribute to process improvements and the development of new methodologies for signal integrity analysis.

Compensation: The compensation information is a good faith estimate only. It is based on what a successful applicant might be paid in accordance with applicable state laws. The actual base salary a successful candidate will be offered within this range will vary based on factors relevant to the position, as well as geography of the selected candidate.

• The salary range for this role is (125,200 - 192,700). The actual base salary a successful candidate will be offered within this range will vary based on factors relevant to the position.

• Bonus Potential: An incentive pay program offers payouts based on company performance, job level, and individual performance.

Benefits:

• Benefits: GM offers a variety of health and wellbeing benefit programs. Benefit options include medical, dental, vision, Health Savings Account, Flexible Spending Accounts, retirement savings plan, sickness and accident benefits, life insurance, paid vacation & holidays, tuition assistance programs, employee assistance program, GM vehicle discounts and more.

GM does not provide immigration-related sponsorship for this role. Do not apply for this role if you will need GM immigration sponsorship now or in the future. This includes direct company sponsorship, entry of GM as the immigration employer of record on a government form, and any work authorization requiring a written submission or other immigration support from the company (e.g., H1-B, OPT, STEM OPT, CPT, TN, J-1, etc).

This role is categorized as hybrid. This means the selected candidate is expected to report to a specific location at least 3 times a week {or other frequency dictated by their manager}. This job may be eligible for relocation benefits.