Staff Package Development Engineer

Job DescriptionThe Package Development Engineer is responsible for developing, qualifying, and industrializing semiconductor package solutions that meet product performance, reliability, manufacturability, cost, and schedule requirements. This role works closely with cross-functional teams, including silicon design, package design, manufacturing, reliability, quality, and OSAT partners to bring new package technologies from concept through high-volume manufacturing.The ideal candidate combines strong semiconductor packaging expertise with a hands-on, problem-solving mindset and the ability to drive complex technology development activities in a global environment.QualificationsBachelor's degree in Packaging Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related technical discipline.Minimum 5+ years of experience in semiconductor package development, package integration, or advanced packaging technologies.Strong knowledge of semiconductor assembly processes, including,Wafer backgrindWafer dicingDie attachFlip-chip assemblyWire bondingUnderfillEncapsulation and moldingBall attachPackage singulationSurface-mount technology (SMT)Experience developing and qualifying semiconductor packages in collaboration with OSAT partners.Knowledge of Design of Experiments (DOE), statistical analysis, and structured problem-solving methodologies.Experience conducting package reliability testing, failure analysis, and root-cause investigations.Strong analytical, project management, and communication skills.Ability to work independently and effectively within cross-functional global teams. Preferred QualificationsMaster's degree or Ph.D. in Packaging Engineering, Mechanical Engineering, Materials Science, Physics, Chemistry, or a related field.Experience with advanced packaging technologies such as:Flip-Chip CSP (FCCSP)System-in-Package (SiP)Fan-Out Packaging (FOPLP/FOWLP)Wafer-Level Packaging (WLP/WLCSP)2.5D/3D PackagingKnowledge of package thermal, mechanical, and electrical characterization techniques.Experience supporting automotive-grade product qualification and reliability standards.Knowledge of sustainability initiatives, packaging materials selection, and cost optimization techniques.Education/Experience:Ph.D. - 2 plus years relevant industry experienceMaster's Degree - 5 plus years relevant industry experienceBachelor's Degree - 7 plus years relevant industry experienceKey Competencies:Strong technical problem-solving skillsEngineering rigor and attention to detailInnovation and research mindsetProject ownership and executionCross-functional leadershipVendor and supplier managementEffective technical communicationAbility to thrive in a fast-paced development environmentContinuous learning and improvement orientationAdditional InformationRenesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.Are you ready to join our team and shape the future with us?Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.SummaryType: Full-timeFunction: EngineeringExperience level: Mid-Senior LevelIndustry: Semiconductors